PIC16F87X
15.1
DC Characteristics:
PIC16F873/874/876/877-04 (Commercial, Industrial)
PIC16F873/874/876/877-20 (Commercial, Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C≤ T
A
≤
+85°C for industrial and
0°C
≤
T
A
≤
+70°C for commercial
Sym
V
DD
Min
4.0
4.5
V
BOR
*
D002*
D003
RAM Data Retention
Voltage (Note 1)
V
DR
-
-
Typ† Max Units
-
-
-
1.5
V
SS
5.5
5.5
5.5
-
-
V
V
V
V
V
See section on Power-on Reset for details
Conditions
XT, RC and LP osc configuration
HS osc configuration
BOR enabled, Fmax = 14MHz (Note 7)
DC CHARACTERISTICS
Param
No.
Characteristic
D001 Supply Voltage
D001A
V
DD
start voltage to
V
POR
ensure internal Power-on
Reset signal
V
DD
rise rate to ensure
internal Power-on Reset
signal
Brown-out Reset Voltage
SV
DD
D004*
0.05
-
-
V/ms See section on Power-on Reset for details
D005
D010
V
BOR
3.7
-
4.0
1.6
4.35
4
V
mA
BODEN bit in configuration word enabled
XT, RC osc configuration
F
OSC
= 4 MHz, V
DD
= 5.5V (Note 4)
HS osc configuration
F
OSC
= 20 MHz, V
DD
= 5.5V
BOR enabled V
DD
= 5.0V
V
DD
= 4.0V, WDT enabled, -40°C to +85°C
V
DD
= 4.0V, WDT disabled, -0°C to +70°C
V
DD
= 4.0V, WDT disabled, -40°C to +85°C
BOR enabled V
DD
= 5.0V
Supply Current (Note 2,5) I
DD
D013
D015*
Brown-out Reset Current
(Note 6)
∆I
BOR
I
PD
-
-
-
-
-
-
7
85
10.5
1.5
1.5
85
15
200
42
16
19
200
mA
µA
µA
µA
µA
µA
D020 Power-down Current
D021 (Note 3,5)
D021A
D023*
Brown-out Reset Current
(Note 6)
∆I
BOR
Legend: * These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1:
This is the limit to which V
DD
can be lowered without losing RAM data.
2:
The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern and temperature also have an
impact on the current consumption.
The test conditions for all I
DD
measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to V
DD
MCLR = V
DD
; WDT enabled/disabled as specified.
3:
The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD
and V
SS
.
4:
For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = V
DD
/2Rext (mA) with Rext in kOhm.
5:
Timer1 oscillator (when enabled) adds approximately 20
µA
to the specification. This value is from character-
ization and is for design guidance only. This is not tested.
6:
The
∆
current is the additional current consumed when this peripheral is enabled. This current should be
added to the base I
DD
or I
PD
measurement.
7:
When BOR is enabled, the device will operate correctly until the V
BOR
voltage trip point is reached.
DS30292B-page 154
©
1999 Microchip Technology Inc.
ETC [ ETC ]
