LEAD 1 INDICATOR
b
D
0.016±.002
1.00+.025
-
e
.050
E
L
0.700±0.015
C
0.007
A
+0.002
-0.001
0.130 MAX.
Q
0.070±0.010
(AT CERAMIC BODY)
Notes:
1. Package material: opaque ceramic.
2. All package plating finishes are per MIL-M-38510.
3. Lid is not connected to any electrical potential.
4. It is recommended that package ceramic be mounted to a heat removal rail located in the
printed circuit board. A thermally conductive material such as Mereco XLN-589 or
equivalent should be used.
Figure 15. 36-Lead Flatpack, Dual Cavity
(50-Mil Lead Spacing)
19