THICK FILM CHIP RESISTORS
CHARACTERISTICS PERFORMANCE
ELECTRICAL CHARACTERISTICS
Item
Direct Current
Resistance
Specification
Within the regulated resistance tolerance.
Jumper chip 50㏁
Test Method
Applying time:within 5 sec
Resistance range(Ω)
R 100
100 R 1K
1K R 10K
10K R 100K
100K R 1M
1M R
∧
∧∧∧
∧
Max test voltage(V)
0.3
1.0
3
10
25
50
T.C.R(Resistance
Temperature
Characteristic)
1 R 10:+300ppm/℃
-200ppm/℃
10 R 1M:±100ppm/℃
1M R 10M:±300ppm/℃
∧
∧
Test temperature(℃) (20)
→
(-55)
→
(20)
→
(125)
→
(20)
T.C.R(ppm/℃) = (R-Ro)/Ro×1/(T-To)
×10
6
T = 20(℃)
T = Test temperature(℃)
Ro = Resistance at room temperature(Ω)
R = Resistance at T(Ω)
Apply 2.5 times rated voltage for 5sec.
Wait 30 minutes at room temperature and measure the
resistance value.
Perform 10,000 cycles at 2.5 times RCW or the Max.
over load voltage
ON(2.5 times rated volage) : 1 sec
OFF
: 25 sec
Have stabilization time of 30 minutes without loading
and measure resistance.
Apply AC 500V for 1 minute.
1005(1/16W), 1608(1/16W):Apply AC 100V for 1 minute
Apply DC 500V for 1 minute.
1005(1/16W), 1608(1/16W):Apply DC 100V for 1 minute
Short-time Overload
Intermittent
Overload
△
R :
±(1%+0.1Ω)
of the initial value
Visual : No evidence of mechanical damage
Jumper chip : 50㏁
△
R :
±(3%+0.1Ω)
of the initial value
Visual : No evidence of mechanical damage
Jumper chip : 50㏁
Dielectric withstand-
ing Voltage
Insulation Resistance
No evidence of mechanical damage.
Over the 1000㏁
MECHANICAL CHARACTERISTICS
Item
Solderability
Specification
Coverage : 95% each termination.
Visual : No crack of termination parts and
ceramic exposure of surface by melting
Test Method
After immersing in flux. dip into the 235±5℃ molten
solder for 2±0.5 sec
Solder : S63A(KSD 6704)
Flux : ROSIN(KSM 2951)
Flux is the composition of ROSIN and the methanol Weight
rate of ROSIN is about 25%
After soldering resistor on the
PCB, 3mm of bending shall
be applied for 10 sec.
Material of PCB : Glass Epoxy
Thickness : 1.6mm
Measure resistance during load application
pull Direction fixed 0.4 lead
Immerse in molten solder at 260±5℃ for 10±1 sec.
Preheat and soldering Procedure
Temperature(℃)
80 - 100
150 - 180
260 + 5
150 - 180
80 - 100
Time(sec)
120
120
10
60
60
Solder : S63A(SSD 6704)
Flux : The composition of ROSIN
(KSM295)25% and methanol
(KSM 1658)75%
Bending Test
△
R :
±(0.5%+0.05Ω)
of the initial value
Visual : No evidence of mechanical damage.
Terminal Strenght
Terminal Strenght
Load pull : 0.5kg
1005(1/16W), 1608(1/16W) 0.3kg
△
R :
±(1%+0.05Ω)
of the initial value
Visual : No evidence of mechanical damage.
Anti-Vibration Test
△
R :
±(1%+0.05Ω)
of the initial value
Visual : No evidence of mechanical damage.
2 hours each in X, Y, and Z axis(toyal 6 hours) 10 to
55 Hz sweep in 1 minute ampiltude.
12
ETC [ ETC ]
