THICK FILM CHIP RESISTORS
CHARACTERISTICS PERFORMANCE
ELECTRICAL CHARACTERISTICS
Item
Specification
Test Method
Within the regulated resistance tolerance.
Applying time:within 5 sec
Resistance range(Ω)
100
Direct Current
Resistance
Jumper chip ꢃ50
㏁
Max test voltage(V)
R
0.3
1.0
3
10
25
50
100ꢃR 1K
1KꢃR 10K
10KꢃR 100K
100KꢃR 1M
1MꢃR
→
→
→
→
T.C.R(Resistance
Temperature
Characteristic)
1ꢃR 10:+300ppm/℃
-200ppm/℃
10ꢃR 1M:±100ppm/℃
1MꢃRꢃ10M:±300ppm/℃
Test temperature(℃) (20) (-55) (20) (125) (20)
T.C.R(ppm/℃) = (R-Ro)/Ro×1/(T-To) ×106
T = 20(℃)
T = Test temperature(℃)
Ro = Resistance at room temperature(Ω)
R = Resistance at T(Ω)
△
Apply 2.5 times rated voltage for 5sec.
Wait 30 minutes at room temperature and measure the
resistance value.
R : ꢃ±(1%+0.1Ω) of the initial value
Short-time Overload
Visual : No evidence of mechanical damage
Jumper chip : ꢃ50
㏁
△
Perform 10,000 cycles at 2.5 times RCW or the Max.
over load voltage
ON(2.5 times rated volage) : 1 sec
Intermittent
Overload
R : ꢃ±(3%+0.1Ω) of the initial value
Visual : No evidence of mechanical damage
Jumper chip : ꢃ50
㏁
OFF
: 25 sec
Have stabilization time of 30 minutes without loading
and measure resistance.
No evidence of mechanical damage.
Over the 1000
Apply AC 500V for 1 minute.
1005(1/16W), 1608(1/16W):Apply AC 100V for 1 minute
Dielectric withstand-
ing Voltage
Insulation Resistance
Apply DC 500V for 1 minute.
1005(1/16W), 1608(1/16W):Apply DC 100V for 1 minute
㏁
MECHANICAL CHARACTERISTICS
Item
Specification
Test Method
Solderability
Coverage : ꢂ95% each termination.
Visual : No crack of termination parts and
ceramic exposure of surface by melting
After immersing in flux. dip into the 235±5℃ molten
solder for 2±0.5 sec
Solder : S63A(KSD 6704)
Flux : ROSIN(KSM 2951)
Flux is the composition of ROSIN and the methanol Weight
rate of ROSIN is about 25%
△
After soldering resistor on the
PCB, 3mm of bending shall
be applied for 10 sec.
Bending Test
R : ꢃ±(0.5%+0.05Ω) of the initial value
Visual : No evidence of mechanical damage.
Material of PCB : Glass Epoxy
Thickness : 1.6mm
Measure resistance during load application
pull Direction fixed 0.4 lead
Terminal Strenght
Terminal Strenght
Load pull : ꢂ0.5kg
1005(1/16W), 1608(1/16W)ꢂ0.3kg
△
R : ꢃ±(1%+0.05Ω) of the initial value
Immerse in molten solder at 260±5℃for 10±1 sec.
Preheat and soldering Procedure
Visual : No evidence of mechanical damage.
Time(sec)
Temperature(℃)
Solder : S63A(SSD 6704)
Flux : The composition of ROSIN
(KSM295)25% and methanol
(KSM 1658)75%
80 - 100
150 - 180
260 + 5
150 - 180
80 - 100
120
120
10
60
60
△
2 hours each in X, Y, and Z axis(toyal 6 hours) 10 to
55 Hz sweep in 1 minute ampiltude.
Anti-Vibration Test
R : ꢃ±(1%+0.05Ω) of the initial value
Visual : No evidence of mechanical damage.
12
ETC [ ETC ]
