THICK FILM CHIP RESISTORS
ELECTRICAL CHARACTERISTICS
Item
Specification
Test Method
△
Low Temperature
exposure
R : ꢃ±(3%+0.1Ω) of the initial value.
Dwell in -55℃ chamber without loading for 1000±12 hours
Dwell for 60 minutes at Room temperature and
Measure resistance value.
Visual : No evidence of mechanical damage.
△
Perform 100Cycles as follows.
Temperature Cycle
R : ꢃ±(1%+0.1Ω) of the initial value.
Visual : No evidence of mechanical damage.
No.
1
Time(min)
Temperature(℃)
-55
±3
30
15
30
15
2
20
±3
±3
±3
3
125
20
4
Load Life in
Moisture
At R 10Ω△R : ꢃ±5%
Temperature : 40±2℃
RH : 90~95%
At R
1
㏁
㏁
△R : ꢃ±(3% + 0.1Ω)
R : ꢃ±5%
Applying rated voltage for 90 minutes “ON” and
30minutes”OFF”
Duration : 1000 hours
At R ꢂ1
△
Visual : No evidence of mechanical damage.
Dwell in Room temperature for 1 hour and measure
resistance value.
Load Life in high
Temperature
At R 10Ω△R : ꢃ±5%
Temperature : 70±3℃ at rated voltage.
Applying rated voltage for 90 minutes “ON” and
30minutes”OFF”
At R
1
㏁
㏁
△R : ꢃ±(3% + 0.1Ω)
R : ꢃ±5%
At R
1
△
Duration : 1000 hours
Dwell in Room temperature for 1 hour and measure
resistance value.
△
Heat Resistance
(High Temperature
Exposure)
R : ꢃ±(3%+0.1Ω) of the initial value.
Visual : No evidence of mechanical damage.
Dwell in 125±3℃ chamber without loading for
1000±12 hours
Dwell in Room temperature for 1 hour and measure
resistance value.
13
ETC [ ETC ]
