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EPF10K100EFI484-2 参数 Datasheet PDF下载

EPF10K100EFI484-2图片预览
型号: EPF10K100EFI484-2
PDF下载: 下载PDF文件 查看货源
内容描述: 现场可编程门阵列(FPGA)的\n [Field Programmable Gate Array (FPGA) ]
分类和应用: 现场可编程门阵列
文件页数/大小: 120 页 / 1759 K
品牌: ETC [ ETC ]
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FLEX 10KE Embedded Programmable Logic Family Data Sheet
s
s
s
Software design support and automatic place-and-route provided by
Altera’s MAX+PLUS
®
II development system for Windows-based
PCs and Sun SPARCstation, HP 9000 Series 700/800, and IBM RISC
System/6000 workstations
Flexible package options
Available in a variety of packages with 144 to 672 pins, including
the innovative FineLine BGA
TM
packages (see
Tables 3
and
4)
SameFrame
TM
pin-out compatibility with FLEX 10KA and
FLEX 10KE devices across a range of device densities and pin
counts
Additional design entry and simulation support provided by EDIF
2 0 0 and 3 0 0 netlist files, library of parameterized modules (LPM),
DesignWare components, Verilog HDL, VHDL, and other interfaces
to popular EDA tools from manufacturers such as Cadence,
Exemplar Logic, Mentor Graphics, OrCAD, Synopsys, Synplicity,
VeriBest, and Viewlogic
Notes (1), (2)
Table 3. FLEX 10KE Package Options & I/O Pin Count
Device
144-Pin 208-Pin
TQFP
PQFP
102
102
102
147
147
147
147
147
189
189
189
189
186
182
240-Pin
PQFP
RQFP
256-Pin 356-Pin 484-Pin 599-Pin 600-Pin 672-Pin
FineLine
BGA
FineLine
BGA
BGA
FineLine
BGA
BGA
BGA
176
191
191
191
191
274
274
274
338
369
470
369
470
424
470
470
338
(3)
413
470
470
220
220
220
254
254
220
(3)
254
(3)
254
(3)
EPF10K30E
EPF10K50E
EPF10K50S
EPF10K100B
EPF10K100E
EPF10K130E
EPF10K200E
EPF10K200S
Notes:
(1)
(2)
(3)
FLEX 10KE device package types include thin quad flat pack (TQFP), plastic quad flat pack (PQFP), power quad
flat pack (RQFP), pin-grid array (PGA), and ball-grid array (BGA) packages.
Devices in the same package are pin-compatible, although some devices have more I/O pins than others. When
planning device migration, use the I/O pins that are common to all devices. The MAX+PLUS II software
versions 9.1 and higher provide features to help designers use only the common pins.
This option is supported with a 484-pin FineLine BGA package. By using SameFrame pin migration, all
FineLine BGA packages are pin-compatible. For example, a board can be designed to support 256-pin, 484-pin, and
672-pin FineLine BGA packages. The MAX+PLUS II software automatically avoids conflicting pins when future
migration is set.
Altera Corporation
3