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DF3687FPV 参数 Datasheet PDF下载

DF3687FPV图片预览
型号: DF3687FPV
PDF下载: 下载PDF文件 查看货源
内容描述: 在处理产品的一般注意事项 [General Precautions on Handling of Product]
分类和应用:
文件页数/大小: 504 页 / 2491 K
品牌: ETC [ ETC ]
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Cautions  
Keep safety first in your circuit designs!  
1. Renesas Technology Corporation puts the maximum effort into making semiconductor  
products better and more reliable, but there is always the possibility that trouble may occur  
with them. Trouble with semiconductors may lead to personal injury, fire or property damage.  
Remember to give due consideration to safety when making your circuit designs, with  
appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of  
nonflammable material or (iii) prevention against any malfunction or mishap.  
Notes regarding these materials  
1. These materials are intended as a reference to assist our customers in the selection of the  
Renesas Technology Corporation product best suited to the customer's application; they do not  
convey any license under any intellectual property rights, or any other rights, belonging to  
Renesas Technology Corporation or a third party.  
2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement  
of any third-party's rights, originating in the use of any product data, diagrams, charts,  
programs, algorithms, or circuit application examples contained in these materials.  
3. All information contained in these materials, including product data, diagrams, charts,  
programs and algorithms represents information on products at the time of publication of these  
materials, and are subject to change by Renesas Technology Corporation without notice due to  
product improvements or other reasons. It is therefore recommended that customers contact  
Renesas Technology Corporation or an authorized Renesas Technology Corporation product  
distributor for the latest product information before purchasing a product listed herein.  
The information described here may contain technical inaccuracies or typographical errors.  
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other  
loss rising from these inaccuracies or errors.  
Please also pay attention to information published by Renesas Technology Corporation by  
various means, including the Renesas Technology Corporation Semiconductor home page  
(http://www.renesas.com).  
4. When using any or all of the information contained in these materials, including product data,  
diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total  
system before making a final decision on the applicability of the information and products.  
Renesas Technology Corporation assumes no responsibility for any damage, liability or other  
loss resulting from the information contained herein.  
5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in  
a device or system that is used under circumstances in which human life is potentially at stake.  
Please contact Renesas Technology Corporation or an authorized Renesas Technology  
Corporation product distributor when considering the use of a product contained herein for any  
specific purposes, such as apparatus or systems for transportation, vehicular, medical,  
aerospace, nuclear, or undersea repeater use.  
6. The prior written approval of Renesas Technology Corporation is necessary to reprint or  
reproduce in whole or in part these materials.  
7. If these products or technologies are subject to the Japanese export control restrictions, they  
must be exported under a license from the Japanese government and cannot be imported into a  
country other than the approved destination.  
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or  
the country of destination is prohibited.  
8. Please contact Renesas Technology Corporation for further details on these materials or the  
products contained therein.  
Rev. 3.00, 05/03, page iii of xxx  
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