SL6609A
COMPONENTS LIST FOR APPLICATION BOARD At 282MHz, 25kHz Channel Spacing.
(LO Circuit in Fig.3)
Resistors
C18
C19
C20
C21
C22
C23
C24
C25
C26
C27
C28
C29
C30
C31
C32
C33
C34
C35
VC1
VC2
VC3
1n
not used
1n
1n
not used
1n
1n
1n
6p8
1n
1n
100p
2u2
2u2
4p7
4p7
3p3
not used
1-10p
1-10p
1-10p
R1
open circuit
R2
R3
open circuit
100
R4
100k
R5
1k
R6
1k
R7
100
R8
R9
open circuit
220k
R10
R11
R12
R13
R14
R15
R16
R17
R18
R19
R20
R21
R22
1M
100k (6)
not used
1k5(1)
4k7
4k7
33k
not used
0R (3)
10k
620
1k
open circuit
Inductors
L1
L2
L3
L4
L5
68n (4)
not used (3)
470n
39n
680n
Capacitors
C1
1n
C2
C3
C4
2p7
4p7
1n
C5
C6
C7
C8
2p7
2u2
1n
100n
1n (2)
2u2
100n
1n
1n
1n
1n
1n
Active Components
Q1
Q2
Q3
Q4
Q5
D1
FMMT589
2SC5065 (Toshiba)
BFT25A (Philips)
not used
C9
C10
C11
C12
C13
C14
C15
C16
C17
C17a
2SC5065 (Toshiba)
Panasonic MA862 (5)
Misc
T1
30nH 1:1
Coilcraft M1686-A
5th Overtone
94.075MHz
Xtal
1n
1n
Notes
1.
2.
The values of R13 is determined by the set-up proce-
dure. See Application Note.
4.
L1and C26 form the low noise matching network for the
RF amplifier. The values given are for the RF amplifier
specified in the Applications Circuit with no Audio AGC
connected. i.e. R17 and D1 omitted.
The value of C9 is determined by the output data rate.
Use 2nF for 512bps, 1nF for 1200bps and 470pF for
2400bps.
5.
6.
Suggested diode for use with the Audio AGC circuit
(see Fig.6) (D1 is not included on the general demon-
stration circuit).
3.
L2 is used in the Audio AGC circuit (see Fig. 6). For the
characteristics of the Audio AGC current source see
Fig.7. If the audio AGC is not required then the current
source (Pin 28) may be disabled by connecting Pin 9
(TCADJ) to VR (Pin 6) and by connecting Pin 28
(IAGCOUT) to Vcc1, (R18). The voltage at Pin 8 may
still be used as an RSSI. R9, C8, C14, C19, R17 and
D1 may then be omitted. See Fig.6 for AGC
component values.
The value of R11 is dependent on the data output load.
R11 should allow sufficient current to drive the data
output load.
7
ZARLINK [ ZARLINK SEMICONDUCTOR INC ]
