Data sheet
MH89790B
2.0 ms
FRAME
15
FRAME
0
FRAME
14
FRAME
15
FRAME
• • • • • • • •
0
TIMESLOT
TIMESLOT
1
TIMESLOT
TIMESLOT
31
• • • •
0
30
125µs
Least
Most
Bit
2
Bit
3
Bit
4
Bit
5
Bit
Bit
7
Bit
8
Bit
1
Significant
Bit (Last)
Significant
Bit (First)
6
(8/2.048)µs
Figure 30 - CEPT PCM 30 Frame & Multiframe Formats
•
The MH89790BN which is a narrow version of the
Packaging
MH89790B and has a row pitch of 0.8”. See Figure
32 for the dimensional drawing for this part.
The MH89790B is available in three package options
which are:
•
The MH89790BS which is a surface mountable
version of the MH89790BN is suitable for Infrared
Reflow (I.R.) soldering. See Figure 33 for the
dimensional drawing, and Figure 34 for the
recommended footprint.
•
The MH89790B which is pin compatible with the
MH89790, has a row pitch of 1.3” and is fitted with
a plastic lid. See Figure 31 for the dimensional
drawing for this part.
2.12
(53.85)
.31
(7.87)
1.3
(33.0)
Note 2
0.10 + 0.01
(2.54 + 0.25)
0.09
(2.3)
MH89790B
0.260
(6.6)
Note 1
2.0
0.020 + 0.002
(0.51 + 0.051)
(50.8)
Notes:
1) Pin 1 not fitted.
2) Row pitch is to the centre of the pins.
3) All dimensions are typical and in inches (mm).
4) Not to scale.
Figure 31 - Physical Dimensions for the 40 Pin Dual in Line Hybrid 1.3" Row Pitch
Zarlink Semiconductor Inc.
27
ZARLINK [ ZARLINK SEMICONDUCTOR INC ]
