MFR62340A-J
Preliminary Information
Use of solder with no-clean flux, i.e. solder that does
not
require
washing
after
assembly,
is
recommended. Washing the module with any kind of
liquid is not advised due to potential damage.
Cleaning the Optical Interface
A protective connector plug is supplied with each
module. This plug should remain in place prior to
use, and be re-attached whenever a fiber cable is not
inserted. This will keep the optical interface free
from dust or other contaminants, which may
potentially degrade the optical signal. Before re-
attaching the connector plug to the module, visually
inspect the plug and remove any contamination. If
the optical interface becomes contaminated, it can
be cleaned with high-pressure nitrogen. Liquids or
physical contact with the optical interface are not
advised due to potential damage.
Electrostatic Discharge (ESD)
The module is classified as Class 1 according to
MIL-STD-883, test method 3015. When handling the
modules, precautions for ESD sensitive devices
should be taken. These precautions include use of
ESD protected work areas with wrist straps,
controlled work benches, floors etc. The
recommendations advised by Zarlink in the technical
note "MFTN6005A Manufacturing Guidelines" should
be followed.
Assembly on Printed Circuit Board
The module can be soldered by hand or by a reflow
process.
• For hand soldering, a soldering iron with its tip
connected to ground should be used. Solder
extractors, including replacement parts, should
be of the non-static generating type.
• For reflow soldering, the recommendations
advised by Zarlink in the technical note
“MFTN6005A Manufacturing Guidelines” should
be followed. This document provides guidelines
about choice of solder, reflow temperature and
time profile etc.
Electromagnetic Interference (EMI)
•
Emission: The electromagnetic emission is
tested in front of the module (module fitted with
EMI shield “-JOS option”), with the module
mounted in a front-panel cutout as shown in fig.
10. The specification is to FCC Class B with
6dB margin.
Immunity: The electromagnetic immunity is
tested without a front panel or enclosure. The
module specification is maintained with an
applied field of 10V/m for frequencies between
80MHz and 1GHz.
•
4
ZARLINK [ ZARLINK SEMICONDUCTOR INC ]
