Le75183
5.0
Operating Ranges
Data Sheet
Package Assembly
Green package devices are assembled with enhanced, environmental compatible lead-free, halogen-free, and
antimony-free materials. The leads possess a matte-tin plating which is compatible with conventional board
assembly processes or newer lead-free board assembly processes. The peak soldering temperature should not
exceed 245°C during printed circuit board assembly.
Refer to IPC/JEDEC J-Std-020B Table 5-2 for the recommended solder reflow temperature profile
.
5.1
Environmental Ranges
Zarlink guarantees the performance of this device over commercial (0 to 70º C) and industrial (-40 to 85ºC)
temperature ranges by conducting electrical characterization over each range and by conducting a production test
with single insertion coupled to periodic sampling. These characterization and test procedures comply with section
4.6.2 of Bellcore GR-357-CORE Component Reliability Assurance Requirements for Telecommunications
Equipment.
Ambient Temperature
−40°
to 85°C
5.2
Electrical Ranges
Supply
Min.
4.5
–19
Typ.
5
—
Max.
5.5
–72
Unit
V
V
V
DD
V
BAT
*
*V
BAT
is used only as a reference for internal protection circuitry. If V
BAT
rises above typically –10 V, the device will enter an all OFF state and
remain in this state until the battery voltage drops below typically –15 V.
*Applied voltage is 100 Vp-p square wave at 100 Hz.
5.3
Handling Precautions
Although protection circuitry has been designed into this device, proper precautions should be taken to avoid
exposure to electrostatic discharge (ESD) during handling and mounting. Zarlink employs a human-body model
(HBM) and a charged-device model (CDM) for ESD-susceptibility testing and protection design evaluation. ESD
voltage thresholds are dependent on the circuit parameters used to define the model. No industry-wide standard
has been adopted for CDM. However, a standard HBM (resistance = 1500Ω, capacitance = 100 pF) is widely used
and therefore can be used for comparison purposes. The HBM ESD threshold presented here was obtained by
using these circuit parameters.
9
Zarlink Semiconductor Inc.
ZARLINK [ ZARLINK SEMICONDUCTOR INC ]
