DIMENSION
MIN
2.20
0.50
1.17 REF
34.80
MAX
2.46
0.70
A
A1
A2
D
35.20
D1
E
E1
b
e
30.00 REF
35.20
0.90
34.80
30.00 REF
E
E1
0.60
1.27
352
Conforms to JEDEC MS - 034
e
D1
D
A2
A1
A
1. CONTROLLING DIMENSIONS ARE IN MM
2. DIMENSION "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER
3. SEATING PLANE IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
4. N IS THE NUMBER OF SOLDER BALLS
5. NOT TO SCALE.
6. SUBSTRATE THICKNESS IS 0.56 MM
Package Code
c
Zarlink Semiconductor 2002 All rights reserved.
Previous package codes:
ISSUE
ACN
DATE
APPRD.