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EA218I6BTAV 参数 Datasheet PDF下载

EA218I6BTAV图片预览
型号: EA218I6BTAV
PDF下载: 下载PDF文件 查看货源
内容描述: [LAN Controller, CMOS, PBGA352]
分类和应用: 局域网外围集成电路
文件页数/大小: 27 页 / 358 K
品牌: ZARLINK [ ZARLINK SEMICONDUCTOR INC ]
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DIMENSION  
MIN  
2.20  
0.50  
1.17 REF  
34.80  
MAX  
2.46  
0.70  
A
A1  
A2  
D
35.20  
D1  
E
E1  
b
e
30.00 REF  
35.20  
0.90  
34.80  
30.00 REF  
E
E1  
0.60  
1.27  
352  
Conforms to JEDEC MS - 034  
e
D1  
D
A2  
A1  
A
1. CONTROLLING DIMENSIONS ARE IN MM  
2. DIMENSION "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER  
3. SEATING PLANE IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.  
4. N IS THE NUMBER OF SOLDER BALLS  
5. NOT TO SCALE.  
6. SUBSTRATE THICKNESS IS 0.56 MM  
Package Code  
c
Zarlink Semiconductor 2002 All rights reserved.  
Previous package codes:  
ISSUE  
ACN  
DATE  
APPRD.  
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