0
225
R
Virtex™-II Platform FPGAs:
Pinout Information
0
0
DS031-4 (v2.0) August 1, 2003
Product Specification
This document provides Virtex-II Device/Package Combi-
nations and Maximum I/Os Available and Virtex-II Pin
Definitions, followed by pinout tables for the following pack-
ages:
•
•
•
•
•
BG728 Standard BGA Package
FF896 Flip-Chip Fine-Pitch BGA Package
FF1152 Flip-Chip Fine-Pitch BGA Package
FF1517 Flip-Chip Fine-Pitch BGA Package
BF957 Flip-Chip BGA Package
•
•
•
•
•
CS144 Chip-Scale BGA Package
FG256 Fine-Pitch BGA Package
FG456 Fine-Pitch BGA Package
FG676 Fine-Pitch BGA Package
BG575 Standard BGA Package
For device pinout diagrams and layout guidelines, refer to
the Virtex-II Platform FPGA User Guide. ASCII package
pinout files are also available for download from the Xilinx
website (www.xilinx.com).
•
CS denotes wire-bond chip-scale ball grid array (BGA)
(0.80 mm pitch).
FG denotes wire-bond fine-pitch BGA (1.00 mm pitch).
FF denotes flip-chip fine-pitch BGA (1.00 mm pitch).
BG denotes standard BGA (1.27 mm pitch).
Virtex-II Device/Package Combinations
and Maximum I/Os Available
Wire-bond and flip-chip packages are available. Table 1 and
Table 2 show the maximum number of user I/Os possible in
wire-bond and flip-chip packages, respectively.
•
•
•
•
BF denotes flip-chip BGA (1.27 mm pitch).
Table 3 shows the number of user I/Os available for all
device/package combinations.
The number of I/Os per package include all user I/Os except
the 15 control pins (CCLK, DONE, M0, M1, M2, PROG_B,
PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN,
DXP, AND RSVD).
Table 1: Wire-Bond Packages Information
Package
Pitch (mm)
CS144
0.80
FG256
1.00
FG456
1.00
FG676
1.00
BG575
1.27
BG728
1.27
Size (mm)
I/Os
12 x 12
92
17 x 17
172
23 x 23
324
27 x 27
484
31 x 31
408
35 x 35
516
Table 2: Flip-Chip Packages Information
Package
Pitch (mm)
FF896
1.00
FF1152
FF1517
BF957
1.00
35 x 35
824
1.00
40 x 40
1,108
1.27
40 x 40
684
Size (mm)
I/Os
31 x 31
624
© 2001-2002 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS031-4 (v2.0) August 1, 2003
Product Specification
www.xilinx.com
1-800-255-7778
Module 4 of 4
1
XILINX [ XILINX, INC ]
