R
Package Marking
Figure 2 provides a top marking example for XA Spartan-3E
FPGAs in the quad-flat packages. Figure 3 shows the top
marking for XA Spartan-3E FPGAs in BGA packages
except the 132-ball chip-scale package (CPG132). The
markings for the BGA packages are nearly identical to those
for the quad-flat packages, except that the marking is
rotated with respect to the ball A1 indicator. Figure 4 shows
the top marking for XA Spartan-3E FPGAs in the CPG132
package.
Note: No marking is shown for stepping.
Mask Revision Code
Fabrication Code
R
R
Process Technology
SPARTAN
Device Type
XA3S250ETM
Date Code
Lot Code
Package
PQG208AGQ0525
D1234567A
Speed Grade
4I
Temperature Range
Pin P1
DS635-1_02_082807
Figure 2: XA Spartan-3E FPGA QFP Package Marking Example
Mask Revision Code
R
BGA Ball A1
Fabrication Code
Process Code
R
SPARTAN
Device Type
XA3S250ETM
FTG256AGQ0525
D1234567A
D1234567A
4I
Date Code
Lot Code
Package
FTG256AGQ0525
Speed Grade
Temperature Range
DS635_03_082807
Figure 3: XA Spartan-3E FPGA BGA Package Marking Example
Ball A1
Device Type
3S250E
F1234567-0525
PHILIPPINES
Lot Code
Date Code
Temperature Range
Package
C6 = CPG132
C6AGQ
4I
Speed Grade
Process Code
Mask Revision Code
Fabrication Code
DS635_04_082807
Figure 4: XA Spartan-3E FPGA CPG132 Package Marking Example
DS635 (v2.0) September 9, 2009
Product Specification
www.xilinx.com
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