R
QPRO XQ4000XL Series QML High-Reliability FPGAs
XQ4000XL Switching Characteristics
Definition of Terms
In the following tables, some specifications may be designated as Advance or Preliminary. These terms are defined as
follows:
Advance:
Preliminary:
Unmarked:
Initial estimates based on simulation and/or extrapolation from other speed grades, devices, or
devicefamilies. Values are subject to change. Use as estimates, not for production.
Based on preliminary characterization. Further changes are not expected.
Specifications not identified as either Advance or Preliminary are to be considered Final.
Except for pin-to-pin input and output parameters, the a.c. parameter delay specifications included in this document are
derived from measuring internal test patterns. All specifications are representative of worst-case supply voltage and junction
temperature conditions.
All specifications subject to change without notice.
Additional Specifications
Except for pin-to-pin input and output parameters, the a.c.
parameter delay specifications included in this document
are derived from measuring internal test patterns. All speci-
fications are representative of worst-case supply voltage
and junction temperature conditions. The parameters
included are common to popular designs and typical appli-
cations. For design considerations requiring more detailed
timing information, see the appropriate family AC supple-
ments available on the Xilinx web site at:
Absolute Maximum Ratings
(1)
Symbol
V
CC
V
IN
V
TS
V
CCt
T
STG
T
SOL
T
J
Supply voltage relative to GND
Input voltage relative to GND
(2)
Voltage applied to High-Z output
(2)
Longest supply voltage rise time from 1V to 3V
Storage temperature (ambient)
Maximum soldering temperature (10s @ 1/16 in. = 1.5 mm)
Junction temperature
Ceramic package
Plastic package
Description
–0.5 to 4.0
–0.5 to 5.5
–0.5 to 5.5
50
–65 to +150
+260
+150
+125
Units
V
V
V
ms
°C
°C
°C
°C
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
2. Maximum DC overshoot or undershoot above V
CC
or below GND must be limited to either 0.5V or 10 mA, whichever is easier to
achieve. During transitions, the device pins may undershoot to –2.0 V or overshoot to V
CC
+ 2.0V, provided this over- or undershoot
lasts less than 10 ns and with the forcing current being limited to 200 mA.
Recommended Operating Conditions
(1)
Symbol
V
CC
V
IH
V
IL
T
IN
Description
Supply voltage relative to GND, T
J
= –55°C to +125°C
Supply voltage relative to GND, T
C
= –55°C to +125°C
High-level input voltage
(2)
Low-level input voltage
Input signal transition time
Plastic
Ceramic
Min
3.0
3.0
50% of V
CC
0
-
Max
3.6
3.6
5.5
30% of V
CC
250
Units
V
V
V
V
ns
Notes:
1. At junction temperatures above those listed as Operating Conditions, all delay parameters increase by 0.35% per °C.
2. Input and output measurement threshold is ~50% of V
CC
.
DS029 (v1.3) June 25, 2000
Product Specification
1-800-255-7778
3
XILINX [ XILINX, INC ]
