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5962-8863405XX 参数 Datasheet PDF下载

5962-8863405XX图片预览
型号: 5962-8863405XX
PDF下载: 下载PDF文件 查看货源
内容描述: [EEPROM, 32KX8, 70ns, Parallel, CMOS, CDIP28, CERAMIC, DIP-28]
分类和应用: 可编程只读存储器电动程控只读存储器电可擦编程只读存储器
文件页数/大小: 21 页 / 196 K
品牌: XICOR [ XICOR INC. ]
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3.12 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitors. This  
reprogrammability test shall be done for initial characterization and after any design or process changes which may affect the  
reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of  
program/erase endurance cycles listed in section 1.3 herein over the full military temperature range. The vendor's procedure  
shall be kept under document control and shall be made available upon request of the acquiring or preparing activity, along with  
test data.  
3.13 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall  
be done for initial characterization and after any design or process change which may affect data retention. The methods and  
procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military  
temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of  
the acquiring or preparing activity, along with test data.  
4. VERIFICATION  
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance MIL-PRF-38535, appendix A.  
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices  
prior to quality conformance inspection. The following additional criteria shall apply:  
a. Burn-in test, method 1015 of MIL-STD-883.  
(1) Test condition D or F. The test circuit shall be maintained by the manufacturer under document revision level  
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall  
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified  
in method 1015 of MIL-STD-883.  
(2) TA = +125°C, minimum.  
(3) Devices shall be burned-in containing a checkerboard pattern or equivalent.  
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter  
tests prior to burn-in are optional at the discretion of the manufacturer.  
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-  
883 including groups A, B, C, and D inspections. The following additional criteria shall apply.  
4.3.1 Group A inspection.  
a. Tests shall be as specified in table II herein.  
b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.  
c. Subgroup 4 (CI and CO measurements) shall be measured for initial qualification and after process or design changes  
which may affect capacitance. Sample size is 15 devices, all input and output terminals tested, and no failures.  
d. As a minimum, subgroups 7 and 8 shall include verification of the truth table.  
SIZE  
STANDARD  
5962-88634  
MICROCIRCUIT DRAWING  
A
REVISION LEVEL  
F
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43218-3990  
17  
DSCC FORM 2234  
APR 97  
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