WM9715L
Production Data
PACKAGE DIMENSIONS
DM029.E
FL: 48 PIN QFN PLASTIC PACKAGE 7 X 7 X 0.9 mm BODY, 0.50 mm LEAD PITCH
D2
SEE DETAIL 1
D
D2/2
48
37
L
INDEX AREA
(D/2 X E/2)
36
1
EXPOSED
GROUND
PADDLE
6
E2/2
E2
E
SEE DETAIL 2
25
12
aaa
C
2 X
2 X
24
13
b
aaa
C
TOP VIEW
e
BOTTOM VIEW
ccc
C
(A3)
A
0.08
C
A1
SIDE VIEW
SEATING PLANE
DETAIL 1
C
DETAIL 2
DETAIL 3
Terminal
tip
R = 0.3MM
Datum
W
e/2
e
T
EXPOSED
GROUND
PADDLE
(A3)
G
H
b
R
Exposed lead
Half etch tie bar
DETAIL 3
Symbols
Dimensions (mm)
MIN
0.80
0
NOM
0.90
MAX
1.00
0.05
NOTE
A
A1
A3
b
0.02
0.20 REF
0.25
0.18
5.00
5.00
0.30
5.25
5.25
1
D
7.00 BSC
5.15
D2
E
7.00 BSC
5.15
E2
e
0.5 BSC
0.213
G
H
L
0.1
0.50
0.30
0.4
0.1
0.2
T
W
Tolerances of Form and Position
aaa
bbb
ccc
REF
0.15
0.10
0.10
JEDEC, MO-220, VARIATION VKKD-2
NOTES:
1. DIMENSION b APPLIED TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.15 mm AND 0.30 mm FROM TERMINAL TIP.
2. ALL DIMENSIONS ARE IN MILLIMETRES
3. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-002.
4. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
5. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
6. REFER TO APPLICATION NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.
PD Rev 4.0 December 2007
76
w
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
