Pre-Production
WM8961
PACKAGE DIMENSIONS
FL: 32 PIN QFN PLASTIC PACKAGE 5 X 5 X 0.9 mm BODY, 0.50 mm LEAD PITCH
DM044.B
D
DETAIL 1
D2
32
25
L
1
24
INDEX AREA
(D/2 X E/2)
4
EXPOSED
GROUND
PADDLE
6
A
E2
E
17
8
aaa
C
2 X
16 15
9
1
b
aaa
C
2 X
B
M
C
A
B
bbb
e
TOP VIEW
BOTTOM VIEW
SIDE VIEW
A3
ccc
C
A3
A
5
0.08
C
R = 0.3MM x 45o
A1
C
SEATING PLANE
EXPOSED
GROUND
PADDLE
DETAIL 2
DETAIL 1
G
b
Exposed lead
DETAIL 2
Dimensions (mm)
Symbols
MIN
0.80
0
NOM
0.85
0.02
MAX
0.90
0.05
NOTE
A
A1
A3
b
0.203 REF
0.25
0.20
3.05
3.05
0.30
3.15
3.15
1
D
5.00 BSC
3.10
D2
E
2
2
5.00 BSC
3.10
E2
e
0.50 BSC
0.625
G
L
0.35
0.40
0.45
Tolerances of Form and Position
aaa
bbb
ccc
0.15
0.10
0.10
REF:
JEDEC, MO-220, VARIATION VHHD-5.
NOTES:
1. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.15 mm AND 0.30 mm FROM TERMINAL TIP.
2. FALLS WITHIN JEDEC, MO-220, VARIATION VHHD-5.
3. ALL DIMENSIONS ARE IN MILLIMETRES.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JEDEC 95-1 SPP-002.
5. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
6. REFER TO APPLICATION NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.
7. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
PP, August 2009, Rev 3.1
115
w
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
