Production Data
WM8912
PACKAGE DIMENSIONS
FL: 32 PIN QFN PLASTIC PACKAGE 4 X 4 X 0.75 mm BODY, 0.40 mm LEAD PITCH
DM067.A
D
D2
32
25
L
1
24
4
INDEX AREA
(D/2 X E/2)
EXPOSED
GROUND
PADDLE
6
A
E2
E
17
8
aaa
C
2 X
16 15
9
1
b
aaa
C
2 X
B
M
C
A
B
bbb
e
TOP VIEW
BOTTOM VIEW
SIDE VIEW
A3
ccc
C
A3
A
5
0.08
C
A1
C
SEATING PLANE
DETAIL 1
G
b
Exposed lead
DETAIL 1
Dimensions (mm)
Symbols
MIN
0.70
0
NOM
0.75
MAX
0.8
NOTE
A
A1
A3
b
0.035
0.05
0.203 REF
0.2
0.15
2.65
2.65
0.25
2.75
2.75
1
D
4.00 BSC
2.7
D2
E
2
2
4.00 BSC
2.7
E2
e
0.40 BSC
0.5
G
L
0.35
0.40
0.45
Tolerances of Form and Position
aaa
bbb
ccc
0.05
0.10
0.10
REF:
NOTES:
1. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.15 mm AND 0.25 mm FROM TERMINAL TIP.
2. ALL DIMENSIONS ARE IN MILLIMETRES.
3. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JEDEC 95-1 SPP-002.
4. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
5. REFER TO APPLICATION NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.
6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
PD, Rev 4.0, September 2010
127
w
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
