WM8762
Production Data
PACKAGE DRAWING
D: 8 PIN SOIC 3.9mm
DM009.B
B
e
8
5
E
H
L
1
4
D
o
h x 45
A1
A
-C-
C
0.10 (0.004)
SEATING PLANE
Dimensions
(mm)
Dimensions
(Inches)
Symbols
MIN
1.35
0.10
0.33
0.19
4.80
MAX
1.75
0.25
0.51
0.25
5.00
MIN
MAX
A
A1
B
C
D
e
0.0532
0.0040
0.0130
0.0075
0.1890
0.0688
0.0098
0.0200
0.0098
0.1968
1.27 BSC
0.050 BSC
E
h
H
L
3.80
0.25
5.80
0.40
0o
4.00
0.50
6.20
1.27
8o
0.1497
0.0099
0.2284
0.0160
0o
0.1574
0.0196
0.2440
0.0500
8o
REF:
JEDEC.95, MS-012
NOTES:
A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS (INCHES).
B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM (0.010IN).
D. MEETS JEDEC.95 MS-012, VARIATION = AA. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.
PD, Rev 4.6, November 2011
15
w
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
