WM8737L
Production Data
PACKAGE DIMENSIONS
FL: 32 PIN QFN PLASTIC PACKAGE 5 X 5 X 0.9 mm BODY, 0.50 mm LEAD PITCH
DM101.A
D
D2
DETAIL 1
32
25
L
1
24
4
INDEX AREA
(D/2 X E/2)
EXPOSED
GROUND
PADDLE
6
E2
E
17
8
aaa
C
2 X
16 15
9
1
b
aaa
C
2 X
B
M
C
A
B
bbb
e
TOP VIEW
BOTTOM VIEW
ccc
C
A3
A
5
0.08
C
A1
C
SIDE VIEW
SEATING PLANE
M
45°
DETAIL 2
M
0.30
EXPOSED
GROUND
PADDLE
DETAIL 1
W
Exposed lead
T
A3
G
H
b
Half etch tie bar
DETAIL 2
Dimensions (mm)
Symbols
NOM
0.90
0.02
MIN
0.80
0
MAX
1.00
0.05
NOTE
A
A1
A3
0.203 REF
0.25
1
b
0.18
3.30
3.30
0.30
3.60
D
5.00 BSC
2
2
D2
E
E2
e
3.45
5.00 BSC
3.45
3.60
0.50 BSC
0.20
G
H
L
0.1
0.40
0.103
0.30
0.50
T
W
0.15
Tolerances of Form and Position
aaa
bbb
ccc
0.15
0.10
0.10
REF:
JEDEC, MO-220, VARIATION VHHD-5.
NOTES:
1. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.15 mm AND 0.30 mm FROM TERMINAL TIP.
2. FALLS WITHIN JEDEC, MO-220, VARIATION VHHD-5.
3. ALL DIMENSIONS ARE IN MILLIMETRES.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JEDEC 95-1 SPP-002.
5. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
6. REFER TO APPLICATION NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.
7. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
PD, Rev 4.4, January 2012
38
w
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
