WM8729
Production Data
PACKAGE DRAWING
DM012.B
D: 16 PIN SOIC 3.9mm Body
e
B
16
9
E
H
1
8
D
L
h x 45o
A1
SEATING PLANE
-C-
α
A
C
0.10 (0.004)
Dimensions
(mm)
Dimensions
(Inches)
Symbols
MIN
1.35
0.10
0.33
0.19
9.80
3.80
MAX
1.75
0.25
0.51
0.25
10.00
4.00
MIN
MAX
A
A1
B
C
D
E
0.0532
0.0040
0.0130
0.0075
0.3859
0.1497
0.0688
0.0098
0.0200
0.0098
0.3937
0.1574
e
1.27 BSC
0.05 BSC
H
h
L
α
5.80
0.25
0.40
0o
6.20
0.50
1.27
8o
0.2284
0.0099
0.0160
0o
0.2440
0.0196
0.0500
8o
REF:
JEDEC.95, MS-012
NOTES:
A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS (INCHES).
B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM (0.010IN).
D. MEETS JEDEC.95 MS-012, VARIATION = AC. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.
PD Rev 4.1 June 2006
17
w
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
