WM8711BL
Production Data
PACKAGE DIMENSIONS
FL: 24 PIN QFN PLASTIC PACKAGE 4 X 4 X 0.9 mm BODY, 0.50 mm LEAD PITCH
DM102.C
DETAIL 1
D
D2
19
24
1
18
EXPOSED
GROUND
PADDLE
INDEX AREA
(D/2 X E/2)
4
6
E2
E
SEE DETAIL 2
13
6
aaa
C
2 X
12
7
1
b
aaa
C
2 X
M
A
B
bbb
C
e
TOP VIEW
BOTTOM VIEW
ccc
C
DETAIL 1
DETAIL 2
A3
A
L
5
0.08
C
Datum
Terminal
Tip
45°
A1
C
SIDE VIEW
0.30mm
EXPOSED
DETAIL 3
e/2
SEATING PLANE
M
M
e
GROUND
PADDLE
W
Exposed lead
T
A3
G
H
Half etch tie bar
b
DETAIL 3
Dimensions (mm)
Symbols
NOM
0.85
MIN
0.80
0
MAX
0.90
0.05
NOTE
A
A1
A3
b
0.035
0.203 REF
0.25
1
0.20
2.40
0.30
2.60
D
4.00 BSC
2.50
2
2
D2
E
E2
e
4.00 BSC
2.50
2.40
2.60
0.50 BSC
0.20
G
0.10
0.40
0.103
0.15
H
L
T
0.35
0.45
W
Tolerances of Form and Position
aaa
bbb
ccc
0.10
0.10
0.10
REF:
JEDEC, MO-220, VARIATION VGGD-8.
NOTES:
1. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.15 mm AND 0.30 mm FROM TERMINAL TIP.
2. FALLS WITHIN JEDEC, MO-220, VARIATION VGGD-8.
3. ALL DIMENSIONS ARE IN MILLIMETRES.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JEDEC 95-1 SPP-002.
5. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
6. REFER TO APPLICATIONS NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.
7. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
PD, Rev 4.2, December 2011
4244
w
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
