WM8224
Production Data
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at
or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical
Characteristics at the test conditions specified.
ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible
to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage
of this device.
Wolfson tests its package types according to IPC/JEDEC J-STD-020B for Moisture Sensitivity to determine acceptable storage
conditions prior to surface mount assembly. These levels are:
MSL1 = unlimited floor life at <30C / 85% Relative Humidity. Not normally stored in moisture barrier bag.
MSL2 = out of bag storage for 1 year at <30C / 60% Relative Humidity. Supplied in moisture barrier bag.
MSL3 = out of bag storage for 168 hours at <30C / 60% Relative Humidity. Supplied in moisture barrier bag.
The Moisture Sensitivity Level for each package type is specified in Ordering Information.
CONDITION
MIN
MAX
Analogue supply voltage: AVDD
Digital supply voltage: DVDD
Digital ground: DGND
GND - 0.3V
GND - 0.3V
GND - 0.3V
GND - 0.3V
GND - 0.3V
GND - 0.3V
GND – 0.3V
GND + 5V
GND + 5V
GND + 0.3V
GND + 0.3V
AVDD + 0.3V
AVDD + 0.3V
DVDD + 0.3V
Analogue grounds: AGND1 2
Analogue inputs (RINP, GINP, BINP)
Other Analogue pins
Digital I/O pins
Operating temperature range: TA
Storage temperature prior to soldering
Storage temperature after soldering
Notes:
0 C
+70 C
30 C max / 85% RH max
+150 C
-65 C
1.
2.
GND denotes the voltage of any ground pin.
AGND1, AGND2 and DGND pins are intended to be operated at the same potential. Differential voltages
between these pins will degrade performance.
RECOMMENDED OPERATING CONDITIONS
CONDITION
SYMBOL
TA
MIN
0
TYP
MAX
70
UNITS
Operating temperature range
Analogue supply voltage
Digital core and I/O supply voltage
C
V
AVDD
DVDD
2.97
2.97
3.3
3.3
3.63
3.63
V
THERMAL PERFORMANCE
PARAMETER
Performance
SYMBOL
TEST CONDITIONS
MIN
TYP
10.27
29.45
MAX
UNIT
°C/W
°C/W
Thermal resistance – junction to
case
RθJC
RθJA
Tambient = 25°C
Thermal resistance – junction to
ambient
Notes:
Figure 3 Figures given are for package mounted on 4-layer FR4 according to JESD51-5 and JESD51-7.
PD, Rev 4.1, June 2012
6
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WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
