WM8199
Production Data
PACKAGE DIMENSIONS
DS: 28 PIN SSOP (10.2 x 5.3 x 1.75 mm)
DM007.D
b
e
28
15
E1
E
GAUGE
PLANE
Θ
14
1
D
0.25
L
c
A1
L1
A A2
-C-
0.10 C
SEATING PLANE
Dimensions
(mm)
NOM
-----
Symbols
MIN
-----
0.05
1.65
0.22
0.09
9.90
MAX
A
A1
A2
b
c
D
e
E
E1
L
2.0
0.25
1.85
0.38
0.25
10.50
-----
1.75
0.30
-----
10.20
0.65 BSC
7.80
7.40
5.00
0.55
8.20
5.60
0.95
5.30
0.75
L1
θ
0.125 REF
0o
4o
8o
JEDEC.95, MO-150
REF:
NOTES:
A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS.
B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.20MM.
D. MEETS JEDEC.95 MO-150, VARIATION = AH. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.
PD Rev 3.2 November 2003
29
w
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
