Production Data Rev 1.0
WM2616
PACKAGE DIMENSIONS
D: 8 PIN SOIC 3.9mm Wide Body
DM009.B
B
e
8
5
E
H
L
1
4
D
h x 45o
A1
A
-C-
a
C
0.10 (0.004)
SEATING PLANE
Dimensions
(mm)
Dimensions
(Inches)
Symbols
MIN
1.35
0.10
0.33
0.19
4.80
MAX
1.75
0.25
0.51
0.25
5.00
MIN
MAX
A
A1
B
C
D
e
0.0532
0.0040
0.0130
0.0075
0.1890
0.0688
0.0098
0.0200
0.0098
0.1968
1.27 BSC
0.050 BSC
E
h
H
L
3.80
0.25
5.80
0.40
0o
4.00
0.50
6.20
1.27
8o
0.1497
0.0099
0.2284
0.0160
0o
0.1574
0.0196
0.2440
0.0500
8o
a
REF:
JEDEC.95, MS-012
NOTES:
A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS (INCHES).
B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM (0.010IN).
D. MEETS JEDEC.95 MS-012, VARIATION = AA. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.
WOLFSON MICROELECTRONICS LTD
Production Data Rev 1.0 June 1999
9
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
