The Communications Edge
TM ECP100D
1 Watt, High Linearity InGaP HBT Amplifier
Product Information
ECP100D-G Mechanical Information
This package is Lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 qC reflow temperature) and leaded
(maximum 245 qC reflow temperature) soldering processes. The plating material on the pins is annealed matte tin over copper.
Product Marking
Outline Drawing
The component will be marked with an
“E100G” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“EC100D” designator followed by an
alphanumeric lot code.
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Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1B
Value:
Test:
Standard:
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Land Pattern
MSL Rating: Level 2 at +260 C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. A heatsink underneath the area of the PCB for the mounted
device is recommended for proper thermal operation.
Damage to the device can occur without the use of one.
2. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25
mm (.010”).
3. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
4. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
5. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
8. All dimensions are in millimeters (inches). Angles are in
degrees.
Thermal Specifications
MTTF vs. GND Tab Temperature
Parameter
Rating
-40 to +85 qC
33 qC / W
159 qC
1000000
100000
10000
1000
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tj (2)
Notes:
1. The thermal resistance is referenced from the junction-to-case at a case
temperature of 85 C. Tjc is a function of the voltage at pins 10 and 11 and
the current applied to pins 10, 11, and 16 and can be calculated by:
Tj = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V, 450 mA at an 85
C case temperature. A minimum MTTF of 1 million hours is achieved for
junction temperatures below 247 C.
100
50
60
70
80
90
100
Tab temperature (° C)
Specifications and information are subject to change without notice
Web site: www.wj.com Page 7 of 7 April 2006
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com
WJCI [ WJ COMMUNICATION. INC. ]
