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ECP053G 参数 Datasheet PDF下载

ECP053G图片预览
型号: ECP053G
PDF下载: 下载PDF文件 查看货源
内容描述: 1/2瓦,高线性度的InGaP HBT放大器 [1/2 Watt, High Linearity InGaP HBT Amplifier]
分类和应用: 放大器射频微波
文件页数/大小: 3 页 / 147 K
品牌: WJCI [ WJ COMMUNICATION. INC. ]
 浏览型号ECP053G的Datasheet PDF文件第1页浏览型号ECP053G的Datasheet PDF文件第2页  
The Communications Edge TM  
ECP053  
1/2 Watt, High Linearity InGaP HBT Amplifier  
Product Information  
ECP053D (16-pin 4x4mm Package) Mechanical Information  
Outline Drawing Product Marking  
The component will be marked with an  
“ECP053D” designator with an alphanumeric  
lot code on the top surface of the package.  
Tape and reel specifications for this part are  
located on the website in the “Application  
Notes” section.  
ESD / MSL Information  
ESD Rating: Class 1B  
Value:  
Test:  
Standard:  
Passes between 500 and 1000V  
Human Body Model (HBM)  
JEDEC Standard JESD22-A114  
Land Pattern  
MSL Rating: Level 3 at +235° C convection reflow  
Standard: JEDEC Standard J-STD-020  
0.25mm DIA. THERMAL GROUND VIA HOLE VIAS ARE  
ON A 0.65mm GRID. VIAS ARE TO BE CONNECTED TO  
BOTTOM, AND INTERNAL GROUIND PLANES IN ORDE  
MAXIMIZE HEAT DISSIPATION. FOR .031" THK FR4 MA  
VIA BARREL PLATTING TO BE MIN. 0.0014 THICK. VIA  
PLUGGED WITH EITHER CONDUCTIVE OR NON-COND  
EPOXY TO PREVENT SOLDER. DRAINS THROUGH VI  
REFLOW PROCESS  
Functional Diagram  
0.65mm  
TYP.  
GROUND PLANE AREA FOR VIAS  
2.23mm X 2.23mm  
16  
15  
14  
13  
N/C  
12  
11  
10  
9
1
2
3
4
Vref  
N/C  
DEVICE GROUND PAD  
2.0mm X 2.0mm  
RF OUT  
RF OUT  
N/C  
RF IN  
N/C  
RECOMMENDED PAD  
0.76mm X 0.34mm  
5
6
7
8
SOLDERMASK SWELL TO BE 0.5mm  
FROM OUTSIDE EDGE OF ALL PADS  
Function  
Vref  
RF Input  
RF Output  
Vbias  
Pin No.  
TYP.  
4.00mm  
1
3
16L 4.0mm X 4.0mm PACKAGE  
10, 11  
16  
GND  
N/C or GND  
Backside Paddle  
2, 4-9, 12-15  
Thermal Specifications  
MTTF vs. GND Tab Temperature  
100000  
Parameter  
Rating  
-40 to +85° C  
62° C / W  
162° C  
Mounting Config. Notes  
Operating Case Temperature  
Thermal Resistance, Rth (1)  
10000  
1000  
100  
1. A heatsink underneath the area of the PCB for the mounted  
device is strictly required for proper thermal operation.  
Damage to the device can occur without the use of one.  
2. Ground / thermal vias are critical for the proper performance  
of this device. Vias should use a .35mm (#80 / .0135”)  
diameter drill and have a final plated thru diameter of .25  
mm (.010”).  
Junction Temperature, Tjc (2)  
Notes:  
1. The thermal resistance is referenced from the junction-  
to-case at a case temperature of 85° C. Tjc is a function  
of the voltage at pins 10 and 11 and the current applied  
to pins 10, 11, and 16 and can be calculated by:  
Tjc = Tcase + Rth * Vcc * Icc  
2. This corresponds to the typical biasing condition of +5V,  
250 mA at an 85° C case temperature. A minimum  
MTTF of 1 million hours is achieved for junction  
temperatures below 247° C.  
3. Add as much copper as possible to inner and outer layers  
near the part to ensure optimal thermal performance.  
4. Mounting screws can be added near the part to fasten the  
board to a heatsink. Ensure that the ground / thermal via  
region contacts the heatsink.  
5. Do not put solder mask on the backside of the PC board in  
the region where the board contacts the heatsink.  
6. RF trace width depends upon the PC board material and  
construction.  
60  
70  
80  
90  
100 110 120  
Tab Temperature (°C)  
7. Use 1 oz. Copper minimum.  
8
All dimensions are in millimeters (inches). Angles are in  
degrees.  
Specifications and information are subject to change without notice  
August 2004  
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com