The Communications Edge TM
ECP053
1/2 Watt, High Linearity InGaP HBT Amplifier
Product Information
ECP053G (SOIC-8 Package) Mechanical Information
Outline Drawing Product Marking
The component will be marked with an
“ECP053G” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1B
Value:
Test:
Standard:
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235° C convection reflow
Standard: JEDEC Standard J-STD-020
Functional Diagram
1
8
7
6
5
2
3
4
Land Pattern
Function
Vref
Input
Pin No.
1
3
Output
Vbias
6, 7
8
GND
N/C or GND
Backside Paddle
2, 4, 5
Mounting Config. Notes
1. A heatsink underneath the area of the PCB for the mounted
device is strictly required for proper thermal operation.
Damage to the device can occur without the use of one.
2. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25
mm (.010”).
3. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
4. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
Thermal Specifications
MTTF vs. GND Tab Temperature
100000
10000
1000
Parameter
Rating
-40 to +85° C
62° C / W
162° C
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tjc (2)
Notes:
5. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85° C. Tjc is a function
of the voltage at pins 6 and 7 and the current applied to
pins 6, 7, and 8 and can be calculated by:
7. Use 1 oz. Copper minimum.
8
All dimensions are in millimeters (inches). Angles are in
degree
100
60
70
80
90
100 110 120
Tjc = Tcase + Rth * Vcc * Icc
Tab Temperature (°C)
2. This corresponds to the typical biasing condition of +5V,
250 mA at an 85° C case temperature. A minimum
MTTF of 1 million hours is achieved for junction
temperatures below 247° C.
Specifications and information are subject to change without notice
August 2004
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
WJCI [ WJ COMMUNICATION. INC. ]
