W83310DS/DG
PRELIMINARY
10. Thermal Performance
Test on Four-Layer (2S2P) JEDEC Test Board
Component Temp. (oC)
ꢀ jc
(oC /W)
14.7
Package
PSOP-8
Power (W)
3.05
Package
100
Die
145
Downset
79
Lead
78
Ambient
25
An area of 190mil*150mil on the top layer is use as a thermal pad for W83310DS and this is con-
nected to the bottom layer by vias. The ꢀja of the W83310DS mounted on this demo board is ab-
out 39 oC /W.Assuming the T =25 oC and T =160 oC,the maximum power dissipation is calculated
A J
as: PD(max)=(160-25)/39=3.46W
11. Ordering Information
Part Number
Package Type
Production Flow
W83310DS
Power SOP-8
12. How to Read the Top Marking
W83
W83
310DS
249GAꢀ
310DG
249GAꢀ
Left line: Winbond logo
1st & 2nd line: W83310DS/DG – the part number
3rd line: Tracking code 318 G A
318: packages assembled in Year 03’, week 18
G
: assembly house ID; O means OSE, G means GR, etc.
A: the IC version
All Trademark and Brand name belong to their respective owners.
11
Publication Release Date: 2005/May
Revision 0.90
WINBOND [ WINBOND ]
