W78E54
Package Dimensions, continued
44-pin TQFP
H D
D
Dimension in inch
Dimension in mm
Symbol
A
Min. Nom. Max. Min. Nom. Max.
34
44
---
---
---
0.047
---
1.20
0.002
0.037
0.004
0.039
0.006
0.041
0.10
1.00
0.05
0.95
0.15
1.05
1
A
2
A
33
1
0.0039 0.013
0.22
0.090
9.9
0.38
0.015
0.008
0.398
0.32
---
b
c
D
E
e
0.200
0.004
0.390
---
0.394
10.00
10.1
10.1
0.952
12.10
12.10
0.75
---
9.9
0.394
0.031
0.472
0.472
0.024
0.039
0.398
0.390
0.025
0.468
10.00
0.80
E
HE
0.036
0.476
0.635
11.90
11.90
0.45
---
12.00
12.00
0.60
D
H
0.468
0.018
---
0.476
0.030
---
E
H
11
L
1.00
1
L
0.003
7
0.08
7
y
q
12
22
e
b
0
0
Notes:
1. Dimension D & E do not include interlead
flash.
c
2. Dimension b does not include dambar
protrusion/intrusion.
3. Controlling dimension: Millimeter
4. General appearance spec. should be based
on final visual inspection spec.
A
A 2
A 1
q
L
See Detail F
y
Seating Plane
L 1
Detail F
Winbond Electronics (H.K.) Ltd.
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2727 N. First Street, San Jose,
CA 95134, U.S.A.
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: 852-27513100
FAX: 852-27552064
FAX: 886-3-5792697
http://www.winbond.com.tw/
TEL: 408-9436666
FAX: 408-5441798
Voice & Fax-on-demand: 886-2-27197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-27190505
FAX: 886-2-27197502
Note: All data and specifications are subject to change without notice.
Publication Release Date: November 1997
Revision A2
- 23 -
WINBOND [ WINBOND ]
