W25Q80BV
11. PACKAGE SPECIFICATION
11.1 8-Pin SOIC 150-mil (Package Code SN)
c
8
5
E
H
E
L
1
4
θ
0.25
D
A
Y
e
SEATING PLANE
GAUGE PLANE
A1
b
MILLIMETERS
INCHES
SYMBOL
Min
Max
Min
Max
A
A1
b
1.35
0.10
0.33
0.19
3.80
4.80
1.75
0.25
0.51
0.25
4.00
5.00
0.053
0.004
0.013
0.008
0.150
0.188
0.069
0.010
0.020
0.010
0.157
0.196
c
E(3)
D(3)
e(2)
1.27 BSC
0.050 BSC
5.80
6.20
0.228
0.244
H
E
Y(4)
L
---
0.40
0°
0.10
1.27
10°
---
0.016
0°
0.004
0.050
10°
θ
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
- 68 -
WINBOND [ WINBOND ]
