W25Q128BV
9.2 16-Pin SOIC 300-mil (Package Code F)
GAUGE PLANE
DETAIL A
MILLIMETERS
SYMBOL
INCHES
Nom
Min
2.36
0.10
---
Nom
2.49
---
Max
2.64
0.30
---
Min
0.093
0.004
---
Max
0.104
0.012
---
A
A1
A2
b
0.098
---
2.31
0.41
0.23
10.31
10.31
7.49
1.27 BSC.
0.81
---
0.091
0.016
0.009
0.406
0.406
0.295
0.050 BSC.
0.032
---
0.33
0.18
10.08
10.01
7.39
0.51
0.28
10.49
10.64
7.59
0.013
0.007
0.397
0.394
0.291
0.020
0.011
0.413
0.419
0.299
C
D
E
E1
e(2)
L
0.38
---
1.27
0.076
8°
0.015
---
0.050
0.003
8°
y
0°
---
0°
---
θ
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
- 70 -
WINBOND [ WINBOND ]
