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W25Q128BV 参数 Datasheet PDF下载

W25Q128BV图片预览
型号: W25Q128BV
PDF下载: 下载PDF文件 查看货源
内容描述: 具有双路和四路SPI 3V 128M位串行闪存 [3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI]
分类和应用: 闪存
文件页数/大小: 74 页 / 756 K
品牌: WINBOND [ WINBOND ]
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W25Q128BV  
8.  
ELECTRICAL CHARACTERISTICS...............................................................................................62  
8.1  
8.2  
8.3  
8.4  
8.5  
8.6  
8.7  
8.8  
8.9  
Absolute Maximum Ratings................................................................................................62  
Operating Ranges...............................................................................................................62  
Power-up Timing and Write Inhibit Threshold ....................................................................63  
DC Electrical Characteristics..............................................................................................64  
AC Measurement Conditions..............................................................................................65  
AC Electrical Characteristics ..............................................................................................66  
AC Electrical Characteristics (cont’d) .................................................................................67  
Serial Output Timing...........................................................................................................68  
Serial Input Timing..............................................................................................................68  
8.10 HOLD Timing......................................................................................................................68  
8.11 WP Timing..........................................................................................................................68  
PACKAGE SPECIFICATION..........................................................................................................69  
9.  
9.1  
9.2  
9.3  
8-Pad WSON 8x6-mm (Package Code E).........................................................................69  
16-Pin SOIC 300-mil (Package Code F) ............................................................................70  
24-Ball TFBGA 8x6-mm (Package Code C).......................................................................71  
10.  
11.  
ORDERING INFORMATION ..........................................................................................................72  
10.1 Valid Part Numbers and Top Side Marking ........................................................................73  
REVISION HISTORY......................................................................................................................74  
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