ADVANCE INFORMATION
Electrical Characteristics
Over the Operating Range
CG6264AM
CG6264AM-70
Parameter
V
CC
V
OH
V
OL
V
IH
V
IL
I
IX
I
OZ
I
CC
Description
Supply Voltage
Output HIGH Voltage I
OH
= –1.0 mA
Output LOW Voltage I
OL
= 2.0mA
Input HIGH Voltage
Input LOW Voltage
Input Leakage
Current
Output Leakage
Current
V
CC
Operating Supply
Current
Automatic CE
Power-Down
Current — CMOS
Inputs
V
CC
= 2.7V to 3.3V
V
CC
= 2.7V to 3.3V(F = 0)
GND < V
I
< V
CC
GND < V
O
< V
CC
, Output Disabled
f = f
MAX
= 1/t
RC
f = 1 MHz
V
CC
= V
CCmax
I
OUT
= 0 mA
CMOS levels
V
CC
= 2.70V
V
CC
= 2.70V
0.8*Vcc
-0.3
–1
–1
13
2.0
Test Conditions
Min.
2.7
2.4
0.4
V
CC
+0.3V
0.4
+1
+1
17
4
350
Typ.
Max.
3.3
Unit
V
V
V
V
V
µA
µA
mA
mA
µA
I
SB1
CE > V
CC
−0.2V
or CE
2
< 0.2V Vcc = 3.3V
V
IN
>V
CC
–0.2V, V
IN
<0.2V)
f = f
MAX
(Address and Data
Only),
f = 0 (OE, WE, BHE and BLE),
V
CC
=3.30V
CE > V
CC
– 0.2V or CE
2
< 0.2V, Vcc = 3.3V
V
IN
> V
CC
– 0.2V or V
IN
< 0.2V,
f = 0, V
CC
= 3.30V
55
I
SB2
Automatic CE
Power-Down
Current — CMOS
Inputs
80
µA
Capacitance
Parameter
C
IN
C
OUT
Description
Input Capacitance
Output Capacitance
Test Conditions
T
A
= 25°C, f = 1 MHz,
V
CC
= V
CC(typ)
Max.
6
8
Unit
pF
pF
Thermal Resistance
Description
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Note:
10. Tested initially and after any design or process changes that may affect these parameters.
Test Conditions
Still Air, soldered on a 3 × 4.5 inch, two-layer printed
circuit board
Symbol
Θ
JA
Θ
JC
BGA
55
16
Unit
°C/W
°C/W
38-XXXXX
Page - 4 - of 12
WEIDA [ WEIDA SEMICONDUCTOR, INC. ]
