1.3 Absolute maximum ratings. 2/
Voltage on any input relative to VSS (devices 01 – 06) -----------------------
(device 07) -------------------------------
Storage temperature range ---------------------------------------------------------
Maximum power dissipation (PD)---------------------------------------------------
Lead temperature (soldering, 10 seconds) -------------------------------------
Thermal resistance, junction-to-case (ΘJC):
-0.5 V dc to +7.0 V dc
-0.5 V dc to +6.0 V dc
-65C to +150C
1.5 W
+260C
Case X ----------------------------------------------------------------------------------
Case Y ----------------------------------------------------------------------------------
Case Z ----------------------------------------------------------------------------------
Junction temperature (TJ) -----------------------------------------------------------
Output current --------------------------------------------------------------------------
5C/W
8C/W
7C/W
+150C 3/
20 mA
1.4 Recommended operating conditions.
Supply voltage range (VCC) ---------------------------------------------------------
Supply voltage (VSS) ------------------------------------------------------------------
Input high voltage range (VIH) ------------------------------------------------------
Input low voltage range (VIL) (devices 01 – 06)---------------------------------
(device 07) -------------------------------
4.5 V dc to 5.5 V dc
0 V
2.2 V dc to VCC + 0.5 V dc
-0.3 V dc to +0.8 V dc 4/
-0.5 V dc to +0.8 V dc 4/
-55C to +125C
Case operating temperature range (TC)------------------------------------------
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in
the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
-
Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM Standard F1192-00
-
Standard Guide for the Measurement of Single Event Phenomena from
Heavy Ion Irradiation of Semiconductor Devices.
(Applications for copies of ASTM publications should be addressed to: ASTM International, PO Box C700, 100 Barr
Harbor Drive, West Conshohocken, PA 19428-2959; http://www.astm.org.)
______________
2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
3/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening
conditions in accordance with method 5004 of MIL-STD-883.
4/ VIL minimum = -3.0 V dc for pulse width less than 20 ns.
SIZE
STANDARD
5962-96795
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
D
SHEET
3
DSCC FORM 2234
APR 97
WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
