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5962-9461203HBA 参数 Datasheet PDF下载

5962-9461203HBA图片预览
型号: 5962-9461203HBA
PDF下载: 下载PDF文件 查看货源
内容描述: [Flash Module, 512KX32, 90ns, CQFP68, CERAMIC, QFP-68]
分类和应用: 内存集成电路
文件页数/大小: 41 页 / 469 K
品牌: WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
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3.5 Programming procedure. The programming procedure shall be as specified by the manufacturer and shall be available  
upon request.  
3.6 Marking of Device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with  
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.  
3.7 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described  
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,  
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those  
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be  
made available to the preparing activity (DLA Land and Maritime-VA) upon request.  
3.8 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this  
drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime-VA shall affirm that the  
manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein.  
3.9 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of  
microcircuits delivered to this drawing.  
3.10 Endurance. A reprogram ability test shall be completed as part of the vendor's reliability monitors. This reprogram  
ability test shall be done for the initial characterization and after any design process changes which may affect the reprogram  
ability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of program/erase  
cycles listed in section 1.3 herein over the full military temperature range. The vendor's procedure shall be kept under document  
control and shall be made available upon request of the acquiring or preparing activity.  
3.11 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall  
be done for initial characterization and after any design process change which may affect data retention. The methods and  
procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military  
temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of  
the acquiring or preparing activity.  
4. VERIFICATION  
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as  
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,  
fit, or function as described herein.  
SIZE  
STANDARD  
5962-94612  
A
MICROCIRCUIT DRAWING  
REVISION LEVEL  
SHEET  
DLA LAND AND MARITIME  
COLUMBUS, OHIO 43218-3990  
J
5
DSCC FORM 2234  
APR 97