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5962-9461108HXC 参数 Datasheet PDF下载

5962-9461108HXC图片预览
型号: 5962-9461108HXC
PDF下载: 下载PDF文件 查看货源
内容描述: [Cache SRAM Module, 512KX32, 25ns, CMOS, CPGA66, HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS-66]
分类和应用: 静态存储器
文件页数/大小: 40 页 / 287 K
品牌: WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
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1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.  
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,  
and E) or QML Listing (Class G and D). The product assurance levels are as follows:  
Device class  
K
Device performance documentation  
Highest reliability class available. This level is intended for use in space  
applications.  
H
G
Standard military quality class level. This level is intended for use in applications  
where non-space high reliability devices are required.  
Reduced testing version of the standard military quality class. This level uses the  
Class H screening and In-Process Inspections with a possible limited temperature  
range, manufacturer specified incoming flow, and the manufacturer guarantees (but  
may not test) periodic and conformance inspections (Group A, B, C, and D).  
E
D
Designates devices which are based upon one of the other classes (K, H, or G)  
with exception(s) taken to the requirements of that class. These exception(s) must  
be specified in the device acquisition document; therefore the acquisition document  
should be reviewed to ensure that the exception(s) taken will not adversely affect  
system performance.  
Manufacturer specified quality class. Quality level is defined by the manufacturers  
internal, QML certified flow. This product may have a limited temperature range.  
1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:  
Outline letter  
Descriptive designator  
Terminals  
Package style  
A
B
M 3/  
T
U
X
Y
9 3/  
See figure 1  
See figure 1  
See figure 1  
See figure 1  
See figure 1  
See figure 1  
See figure 1  
See figure 1  
68  
68  
68  
66  
66  
66  
68  
68  
Co-fired ceramic, quad flatpack, single cavity  
Ceramic, quad flatpack, single cavity  
Co-fired ceramic, single/dual cavity, quad flatpack  
Hex-in-line, single cavity, with standoffs  
Hex-in-line, single cavity, with standoffs  
Hex-in-line, single cavity, with standoffs  
Ceramic, quad flatpack, single cavity  
Ceramic, quad flatpack, single cavity  
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.  
3/ Due to the short leads of case outlines M (single cavity) and case outline 9, caution should be taken if the system  
application is to be used where extreme thermal transitions can occur. Case outline A can be used if longer leads are  
necessary.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-94611  
A
REVISION LEVEL  
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
3
R
DSCC FORM 2234  
APR 97  
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