Assembly Instructions for SCA6x0 and SCA10x0 series
TN71
4. Devices require bake, before mounting, if:
a) Humidity Indicator Card is > 10% when read at 23 ± 5 °C
b) 3a or 3b not met.
5. If baking is required, devices may be baked for 24 hours at 85°C.
Note: Also Tape&Reel materials are applicable for baking at 85°C
Note: Packing materials and procedures according to IPC/JEDEC J-STD-033
Note: Level and body temperature defined by IPC/JEDEC J-STD-020
5.8 Inspection
Optical and visual inspection of solder joints can be done easily, since the solder joints are clearly
seen. A visual inspection of the solder joints with conventional AOI (automatic optical inspection)
system can be used. Also X-ray inspection can be used.
Cross-sectional analysis is also an approved method to inspect how well solder has wetted the
pads of component. Cross-sectional analysis is not used for production inspection, but if required, it
can be used to establish and optimize the component assembly process parameters. Cross-
sectioning is a destructive inspection method. An example of a DIL solder joint cross-section in
presented in Figure 9.
mag.
x5
mag.
x20
mag.
x50
Figure 9: Cross-section of the DIL package lead's solder joint (with eutectic SnPb solder).
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