Assembly Instructions for SCA6x0 and SCA10x0 series
TN71
Figure 13. Tool head is carefully pressed
around component and kept in this
position for few seconds.
Figure 14. Immediately after solder
melting, component is this lifted.
Remove the solder from the PCB using either a solder vacuum or solder braid making sure to clean
the area of solder thoroughly.
Figure 15. Soldering iron and solder braid used for solder removal.
Note that the performance and the reliability of the reworked component may have
decreased due to the rework operation! VTI does not recommend rework.
8
9
Environmental Aspects
VTI Technologies respects environmental values and thus, its DIL packages are lead-free and
RoHS compatible. VTI Technologies’ sensors should be soldered with lead-free solders in order to
guarantee full RoHS compatibility.
References
JEDEC / Electronic Industries Alliance, Inc. Moisture/ReflowSensitivity Classification for Non-
Hermetic Solid State Surface Mount Devices (J-STD-020C).
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
(IPC/JEDEC J-STD-033).
VTI Technologies Oy
www.vti.fi
11/12
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VTI [ VTI TECHNOLOGIES ]
