VITESSE
SEMICONDUCTOR CORPORATION
Datasheet
2.5Gb/s 17x17 Crosspoint Switch
with Input Signal Activity (ISA) Monitoring
VSC834
Package Information
27mm 256 BGA Package Drawing
g
BOTTOM VIEW
e
17 15 13 11
19
18 16
9
7
5
3
1
10
DETAIL B
g
14 12
4
2
10
8
6
20
A
e
B
D
F
C
E
G
J
H
K
0.30 S C A S B S
0.10 S C
b
L
N
M
P
E1
4
R
U
T
V
Y
W
0.10
D
-A-
CORNER
DETAIL B
-B-
D1
11
A1
c
A
F
P
TOP VIEW
ccc
//
C
E
-C-
6
5
aaa C
45 DEGREE 0.5MM CHAMFER (4 PLCS)
NOTES:
DIMENSIONAL REFERENCES
NOM.
1.80
0.65
27.00
MAX.
1.95
0.70
REF.
A
A1
D
D1
MIN.
1.65
0.60
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. "e" REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
3. "M" REPRESENTS THE BASIC SOLDER BALL MATRIX SIZE,
AND SYMBOL "N" IS THE MAXIMUM ALLOWABLE NUMBER OF
BALLS AFTER DEPOPULATING.
26.80
27.20
24.13 (BSC.)
26.80
27.00
24.13 (BSC.)
0.75
27.20
E
E1
b
c
M
N
aaa
ccc
e
4. "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER
PARALLEL TO PRIMARY DATUM -C- .
0.65
1.05
0.85
1.25
5.
DIMENSION "aaa" IS MEASURED PARALLEL TO PRIMARY DATUM -C- .
1.15
20
256
6. PRIMARY DATUM -C- AND SEATING PLANE ARE DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
7. PACKAGE SURFACE SHALL BE BLACK OXIDE.
0.25
0.25
8. CAVITY DEPTH VARIOUS WITH DIE THICKNESS
9. SUBSTRATE MATERIAL BASE IS COPPER.
1.27 TYP.
P
g
0.15
0.40
10. BILATERAL TOLENANCE ZONE IS APPLIED TO EACH SIDE OF PACKAGE BODY
11. 45 DEG 0.5 mm CHAMFER CORNER AND WHITE DOT FOR PIN 1 IDENTIFICATION.
12. DIMENSION F IS THE MAX. ENCAP. HEIGHT
0.50
F
G52247-0, Rev 4.2
02/09/01
Page 15
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Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com
Internet: www.vitesse.com
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