VITESSE
SEMICONDUCTOR CORPORATION
Datasheet
2.5Gb/s 17x17 Crosspoint Switch
with Input Signal Activity (ISA) Monitoring
VSC834
Package Pin Descriptions
The VSC834 is packaged in a 27x27mm 256 pin ball grid array package. The 256 BGA package is ther-
mally enhanced and carries the high-speed signals over controlled impedance lines from the solder ball to the
circuit die. The following sections describe the pinout and mechanical details of the VSC834.
Figure 5: Functional Pinout Floorplan
Programming
Interface
A0 A2 A4
A16
I/P LOA and Termination
Control Logic
17:1 Switch Slice Pair
17:1 Switch Slice Pair
17:1 Switch Slice Pair
17:1 Switch Slice Pair
Y0
Y2
Y1
Y3
17:1 Switch Slice Pair
17:1 Switch Slice Pair
I/P LOA and Termination
Y15
Y16
Control Logic
A1 A3 A5
A15
Programming
Interface
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Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com
Internet: www.vitesse.com
Page 10
G52247-0, Rev 4.2
02/09/01
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
