VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Data Sheet
2.488Gb/s 1:32 SONET/SDH Demux
VSC8132
Decoupling of the power supplies is a critical element in maintaining the proper operation of the part. It is
recommended that the V
CC
power supply be decoupled using a 0.1
µ
F and 0.01
µ
F capacitor placed in parallel
on each V
CC
power supply pin as close to the package as possible. If room permits, a 0.001
µ
F capacitor should
also be placed in parallel with the 0.1
µ
F and 0.01
µ
F capacitors mentioned above. Recommended capacitors are
low-inductance ceramic SMT X7R devices. For the 0.1
µ
F capacitor, a 0603 package should be used. The
0.01
µ
F and 0.001
µ
F capacitors can be either 0603 or 0402 packages.
For low frequency decoupling, 47
µ
F tantalum, low-inductance SMT caps should be sprinkled over the
board’s main +3.3V power supply and placed close to the C-L-C pi filter.
If the device is being used in an ECL environment with a -3.3V supply, all references to decoupling V
CC
must be changed to V
EE
, and all references to decoupling 3.3V must be changed to -3.3V.
AC Characteristics
Figure 2: Output Timing
t
PD1
t
PD2
78MHz CLK
78MHz DATA
SYNC PULSE
PARITY
Figure 3: Data Output Timing
t
SERSU
DI+
Differential Serial Data Input
t
SERHO
D0
LSB
Time
CLKI+
Differential Clock Input
D31
MSB
NOTE: Bit 31 (MSB) is received first, Bit 0 (LSB) is received last.
Page 4
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VITESSE
SEMICONDUCTOR CORPORATION
• 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com
Internet: www.vitesse.com
G52250-0, Rev 3.1
12/7/00
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
