2354µm (0.0927")
GND
Pad 37
GND
Pad 38
GND
GND
GND
VSS
Pad 42
VSS
Pad 43
VSS
Pad 44 Pad 45
VSS
GND
Pad 46 Pad 47 Pad 48
GND
GND
IB
Pad 34
IB
Pad 35
GND
Pad 36
Pad 39 Pad 40 Pad 41
GND
GND
Pad 33
Pad 1
DOUT
Pad 32
NDIN
Pad 2
50µm
(0.002")
GND
GND
Pad 31
Pad 3
GND
GND
Pad 30
Pad 4
GND
Pad 29
GND
Pad 5
1754µm
(0.0691")
VSC7991
GND
GND
Pad 28
Pad 6
GND
GND
Pad 27
Pad 7
NDOUT
Pad 26
DIN
Pad 8
GND
GND
Pad 25
Pad 9
IP
IP
GND
GND
VIP
VSS
VSS
VSS
VSS
DCC
GND
GND
IBN
IBN
NC
Pad 22
Pad 21
Pad 20
Pad 19
Pad 18
Pad 17
Pad 16
Pad 15 Pad 14
Pad 13
Pad 12 Pad 11
Pad 24
Pad 23
Pad 10
NOTE: All dimensions are in micrometers. The 48 pads specified in the pad coordinates were merged into 24 larger pads.
50µm
(0.002")
Die Size: 2354µm x 1754µm (0.0927" x 0.0691")
Die Thickness: 381µm (0.015")
Pad Pitch: 150µm (0.0059")
Pad Size: 116µm x 116µm (0.0046" x 0.0046")
Pad Passivation Opening: 100µm x 100µm (0.0039" x 0.0039")
Scribe Size: 50µm (0.002")
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
