2159µm (0.085")
Pad 39
IBIAS
Pad 38
VDD
Pad 37
VDD
Pad 36
VDD
Pad 35
VDD
Pad 34
NC
Pad 33
VDD
Pad 32
IOUT
Pad 31
VDD
Pad 30
NIOUT
Pad 29
VDD
Pad 28
NC
Pad 27
VDD
Pad 26
VDD
Pad 25
VDD
Pad 24
VDD
Pad 40
IBIAS
Pad 23
VIP
Pad 41
NC
Pad 22
MIP
0.002"
(51µm)
Pad 21
VSS
Pad 42
VIB
1270µm
(0.050")
Pad 20
VSS
Pad 43
MIB
VSC7990
Pad 19
MOD_EN
Pad 44
VSS
Pad 45
VSS
Pad 18
PWN
Pad 46
VTHDN
Pad 17
PWP
Pad 1
VTHD
Pad 2
VDD
Pad 3
DIN
Pad 4
VDD
Pad 5
NDIN
Pad 6
VDD
Pad 7
CLK
Pad 8
VDD
Pad 9
CLKN
Pad 10
VDD
Pad 11
VDD
Pad 12
VDD
Pad 13
VDD
Pad 14
CLKSEL
Pad 15
VDD
Pad 16
NC
Die Size with Scribe: 2159µm x 1270µm (0.085" x 0.050")
Die Thickness: 381µm (0.015")
Pad Pitch: 127µm (0.005")
0.002"
(51µm)
Pad to Pad Clearance: 51µm (0.002")
Pad Size: 77µm x 77µm (0.003" x 0.003")
Pad Passivation Opening: 76.2µm x 76.2µm (0.003" x 0.003")
Scribe Size: 50µm (0.002")
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
