G52303-0, Rev 2.0
12/15/00
VSC7990
1270µm (0.050")
Pad 36
NC
Pad 23
VIP
Pad 22
MIP
Pad 21
VSS
Pad 35
VDD
Pad 34
NC
Pad 33
VDD
Pad 32
IOUT
Pad 31
VDD
Pad 30
NIOUT
Pad 29
VDD
Pad 28
NC
Pad 27
VDD
Pad 26
NC
Pad 25
VDD
Pad 24
VDD
Pad 39
IBIAS
Pad 38
VDD
Pad 37
VDD
Package Pin Descriptions
Pad 40
IBIAS
Advance Product Information
Pad 41
NC
Pad 42
VIB
0.002"
(51µm)
2159µm
(0.085")
Pad 43
VSS
VSC7990
Pad 20
VSS
Pad 19
MOD_EN
Pad 18
PWN
Pad 17
PWP
Pad 44
VSS
Pad 45
VSS
SEMICONDUCTOR CORPORATION
Figure 5: Pad Assignments
Pad 46
VTHDN
Pad 4
VDD
Pad 5
NDIN
Pad 6
VDD
Pad 7
CLK
Pad 8
VDD
Pad 9
CLKN
Pad 10
VDD
Pad 11
NC
Pad 12
VDD
Pad 13
NC
Pad 14
CLKSEL
Pad 15
VDD
VITESSE
Pad 1
VTHD
Pad 2
VDD
Pad 3
DIN
Pad 16
NC
©
VITESSE
SEMICONDUCTOR CORPORATION
• 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com
Internet: www.vitesse.com
Die Size with Scribe: 2159µm x 1270µm (0.085" x 0.050")
Die Thickness: 381µm (0.015")
Pad Pitch: 127µm (0.005")
Pad to Pad Clearance: 51µm (0.002")
Pad Size: 77µm x 77µm (0.003" x 0.003")
Pad Passivation Opening: 76.2µm x 76.2µm (0.003" x 0.003")
Scribe Size: 50µm (0.002")
0.002"
(51µm)
SONET/SDH 10.7Gb/s
Laser Diode Driver
Page 7
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
