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VS8061FI 参数 Datasheet PDF下载

VS8061FI图片预览
型号: VS8061FI
PDF下载: 下载PDF文件 查看货源
内容描述: [Telecom Circuit, 1-Func, GAAS, CQFP52, HEAT SINK, CERAMIC, LDCC-52]
分类和应用: ATM异步传输模式
文件页数/大小: 20 页 / 408 K
品牌: VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
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VITESSE  
SEMICONDUCTOR CORPORATION  
Datasheet  
2.5 Gb/s 16-Bit Multiplexer/  
Demultiplexer Chipset  
VSC8061/VSC8062  
Ordering Information  
The order number for this product is formed by a combination of the device number, package type, and the  
operating temperature range.  
FC  
VS80XX  
Device Type  
VS8061 - 2.5 Gb/s 16-bit Multiplexer  
VS8062 - 2.5 Gb/s 16-bit Demultiplexer  
Package and Temperature  
FC: 52 Pin Ceramic Leaded Chip Carrier (LDCC),  
0° C ambient to +70° C case  
FI: 52 Pin Ceramic Leaded Chip Carrier (LDCC),  
-40° C ambient to +85° C case  
QH: 52 Pin Plastic Quad Flat Pack (PQFP),  
0° C ambient to +85° C case  
Notice  
Vitesse Semiconductor Corporation reserves the right to make changes in its products, specifications or other  
information at any time without prior notice. Therefore the reader is cautioned to confirm that this datasheet is current  
prior to placing any orders. The company assumes no responsibility for any circuitry described other than circuitry  
entirely embodied in a Vitesse product.  
Warning  
Vitesse Semiconductor Corporation’s product are not intended for use in life support appliances, devices or sys-  
tems. Use of a Vitesse product in such applications without the written consent is prohibited.  
G52069-0, Rev. 4.1  
6/22/99  
VITESSE SEMICONDUCTOR CORPORATION  
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896  
Page 19  
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