VITESSE
SEMICONDUCTOR CORPORATION
Datasheet
2.5 Gb/s 16-Bit Multiplexer/
Demultiplexer Chipset
VSC8061/VSC8062
Package Information
52-Pin Ceramic LDCC (F) Package
B
A
I
J
K
L
C
HEAT SINK SIDE
D
PACKAGE IS
CAVITY DOWN
M
52
1
45o
E
N
O
Item
mm (Min/Max)
in (Min/Max)
Item
mm (Min/Max)
in (Min/Max)
A
B
18.54/19.56
1.02/1.52
0.730/0.770
0.040/0.060
0.610/0.650
0.600 TYP
0.050 TYP
I
J
0.41/0.61
2.03/2.79
0.09/0.24
4.57/5.34
27.69/30.22
0.36/0.56
1.75/1.90
0.016/0.024
0.080/0.110
0.003/0.009
0.180/0.210
1.090/1.190
0.014/0.022
0.069/0.075
C*
D*
E
15.49/16.51
15.24 TYP
1.27 TYP
K*
L
M
N
O
* At package body.
Notes: 1) Drawings not to scale
2) Packages: Ceramic (alumina); Heat Sinks: Copper Tungsten; Leads: Alloy 42 with gold plating.
Page 14
VITESSE SEMICONDUCTOR CORPORATION
G52069-0, Rev. 4.1
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896
6/22/99
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
