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VO3526 参数 Datasheet PDF下载

VO3526图片预览
型号: VO3526
PDF下载: 下载PDF文件 查看货源
内容描述: 功率光敏可控硅 [Power Phototriac]
分类和应用: 可控硅
文件页数/大小: 8 页 / 116 K
品牌: VISHAY [ VISHAY ]
 浏览型号VO3526的Datasheet PDF文件第1页浏览型号VO3526的Datasheet PDF文件第3页浏览型号VO3526的Datasheet PDF文件第4页浏览型号VO3526的Datasheet PDF文件第5页浏览型号VO3526的Datasheet PDF文件第6页浏览型号VO3526的Datasheet PDF文件第7页浏览型号VO3526的Datasheet PDF文件第8页  
VO3526  
Power Phototriac  
Vishay Semiconductors  
ABSOLUTE MAXIMUM RATING CURVES  
80  
60  
40  
20  
0
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
- 40 - 20  
0
20 40 60  
80  
100 120  
- 40 - 20  
0
20 40 60 80 100 120  
21296  
TA - Ambient Temperature (°C)  
21502  
Ambient Temperature (°C)  
Fig. 2 - Allowable Load Current vs. Ambient Temperature  
Fig. 1 - Power Dissipation vs. Temperature  
Note  
The allowable load current was calculated out under a given  
operating conditions and only for reference:  
LED power: QE = 0.015 W, θBA (4-layer) = 30 °C/W  
TCASE  
TCASE  
THERMAL CHARACTERISTICS  
TB  
TB  
PARAMETER  
SYMBOL VALUE  
UNIT  
Maximum LED  
junction temperature  
Tjmax.  
Tjmax.  
θNOT-B  
θNOT-C  
θOT-B  
θOT-C  
θE-B  
105  
105  
75  
°C  
θNOT-C θOT-C  
θNOT-B  
θOT-B  
Maximum NOT  
junction temperature  
°C  
θNOT-OT  
QNOT  
QOT  
Thermal resistance,  
junction NOT to bord  
TNOT  
TOT  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
Thermal resistance,  
junction NOT to case  
Power Triac  
Thermal Model  
θE-NOT  
θE-OT  
150  
158  
157  
149  
161  
243  
420  
235  
130  
Thermal resistance,  
junction OT to board  
TB  
TCASE  
QE TE  
Thermal resistance,  
junction OT to case  
θE-B  
θE-C  
θBA  
θCA  
Thermal resistance,  
junction emitter to board  
TB  
TCASE  
Thermal resistance,  
junction emitter to case  
θE-C  
21295  
TA  
Thermal resistance,  
junction NOT to junction OT  
θNOT-OT  
θE-NOT  
θE-OT  
θCA  
Thermal Model  
Thermal resistance,  
junction emitter to junction NOT  
NOT: Non-opto-triac  
OT:  
TB:  
Opto-triac  
Board temperature  
Thermal resistance,  
junction emitter to junction OT  
Thermal resistance,  
case to ambient  
TCASE: Case temperature  
TA:  
Ambient temperature  
Note  
θBA  
:
Thermal resistance, board to ambient  
LED power dissipation  
The thermal model is represented in the thermal network below.  
Each resistance value given in this model can be used to calculate  
the temperatures at each node for a given operating condition. The  
thermal resistance from board to ambient will be dependent on the  
type of PCB, layout and thickness of copper traces. For a detailed  
explanation of the thermal model, please reference Vishay's  
Thermal Characteristics of Power Phototriac application note.  
QE:  
QOT  
:
OT power dissipation  
QNOT  
:
NOT power dissipation  
www.vishay.com  
2
For technical questions, contact: optocoupler.answers@vishay.com  
Document Number: 81842  
Rev. 1.2, 23-Oct-08