欢迎访问ic37.com |
会员登录 免费注册
发布采购

IRFR310 参数 Datasheet PDF下载

IRFR310图片预览
型号: IRFR310
PDF下载: 下载PDF文件 查看货源
内容描述: 功率MOSFET [Power MOSFET]
分类和应用:
文件页数/大小: 8 页 / 1417 K
品牌: VISHAY [ VISHAY TELEFUNKEN ]
 浏览型号IRFR310的Datasheet PDF文件第2页浏览型号IRFR310的Datasheet PDF文件第3页浏览型号IRFR310的Datasheet PDF文件第4页浏览型号IRFR310的Datasheet PDF文件第5页浏览型号IRFR310的Datasheet PDF文件第6页浏览型号IRFR310的Datasheet PDF文件第7页浏览型号IRFR310的Datasheet PDF文件第8页  
IRFR310, IRFU310, SiHFR310, SiHFU310
Vishay Siliconix
Power MOSFET
PRODUCT SUMMARY
V
DS
(V)
R
DS(on)
(Ω)
Q
g
(Max.) (nC)
Q
gs
(nC)
Q
gd
(nC)
Configuration
V
GS
= 10 V
12
1.9
6.5
Single
D
FEATURES
400
3.6
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• Surface Mount (IRFR310/SiHFR310)
• Straight Lead (IRFU310/SiHFU310)
• Available in Tape and Reel
• Fast Switching
• Fully Avalanche Rated
• Lead (Pb)-free Available
Available
RoHS*
COMPLIANT
DPAK
(TO-252)
IPAK
(TO-251)
G
DESCRIPTION
Third generation Power MOSFETs form Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU/SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
S
N-Channel
MOSFET
ORDERING INFORMATION
Package
Lead (Pb)-free
SnPb
DPAK (TO-252)
IRFR310PbF
SiHFR310-E3
IRFR310
SiHFR310
DPAK (TO-252)
IRFR310TRLPbF
a
SiHFR310TL-E3
a
IRFR310TRL
a
SiHFR310TL
a
DPAK (TO-252)
IRFR310TRPbF
a
SiHFR310T-E3
a
IRFR310TR
a
SiHFR310T
a
DPAK (TO-252)
IRFR310TRRPbF
a
SiHFR310TR-E3
a
-
-
IPAK (TO-251)
IRFU310PbF
SiHFU310-E3
IRFU310
SiHFU310
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS
T
C
= 25 °C, unless otherwise noted
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Current
a
V
GS
at 10 V
T
C
= 25 °C
T
C
= 100 °C
SYMBOL
V
DS
V
GS
I
D
LIMIT
400
± 20
1.7
1.1
6.0
0.20
0.020
86
1.7
2.5
25
2.5
4.0
- 55 to + 150
260
d
UNIT
V
A
I
DM
Pulsed Drain
Linear Derating Factor
Linear Derating Factor (PCB Mount)
e
E
AS
Single Pulse Avalanche Energy
b
a
I
AR
Repetitive Avalanche Current
a
E
AR
Repetitive Avalanche Energy
Maximum Power Dissipation
T
C
= 25 °C
P
D
e
T
A
= 25 °C
Maximum Power Dissipation (PCB Mount)
dV/dt
Peak Diode Recovery dV/dt
c
Operating Junction and Storage Temperature Range
T
J
, T
stg
Soldering Recommendations (Peak Temperature)
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
DD
= 50 V, starting T
J
= 25 °C, L = 52 mH, R
G
= 25
Ω,
I
AS
= 1.7 A (see fig. 12).
c. I
SD
1.7 A, dI/dt
40 A/µs, V
DD
V
DS
, T
J
150 °C.
d. 1.6 mm from case.
e. When mounted on 1” square PCB (FR-4 or G-10 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91272
S-81367-Rev. A, 21-Jul-08
W/°C
mJ
A
mJ
W
V/ns
°C
www.vishay.com
1