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IL4208-X007T 参数 Datasheet PDF下载

IL4208-X007T图片预览
型号: IL4208-X007T
PDF下载: 下载PDF文件 查看货源
内容描述: 光电耦合器,光敏可控硅输出,高dv / dt ,低输入电流 [Optocoupler, Phototriac Output, High dV/dt, Low Input Current]
分类和应用: 可控硅光电三端双向交流开关输出元件
文件页数/大小: 7 页 / 169 K
品牌: VISHAY [ VISHAY ]
 浏览型号IL4208-X007T的Datasheet PDF文件第1页浏览型号IL4208-X007T的Datasheet PDF文件第3页浏览型号IL4208-X007T的Datasheet PDF文件第4页浏览型号IL4208-X007T的Datasheet PDF文件第5页浏览型号IL4208-X007T的Datasheet PDF文件第6页浏览型号IL4208-X007T的Datasheet PDF文件第7页  
IL420, IL4208  
Vishay Semiconductors  
Optocoupler, Phototriac Output,  
High dV/dt, Low Input Current  
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)  
PARAMETER  
TEST CONDITION  
PART  
SYMBOL  
VALUE  
UNIT  
INPUT  
Reverse voltage  
Forward current  
Surge current  
Power dissipation  
Derate from 25 °C  
OUTPUT  
VR  
IF  
6
V
mA  
60  
IFSM  
Pdiss  
2.5  
100  
1.33  
A
mW  
mW/°C  
IL420  
VDRM  
VDRM  
ITM  
600  
800  
300  
3
V
V
Peak off-state voltage  
IL4208  
RMS on-state current  
Single cycle surge current  
Power dissipation  
Derate from 25 °C  
COUPLER  
mA  
A
ITSM  
Pdiss  
500  
6.6  
mW  
mW/°C  
Isolation test voltage  
between emitter and detector  
t = 1 s  
VISO  
5300  
VRMS  
Pollution degree (DIN VDE 0109)  
Creepage distance  
2
7  
mm  
mm  
Clearance distance  
7  
Comparative tracking (1)  
175  
V
IO = 500 V, Tamb = 25 °C  
RIO  
RIO  
1012  
1011  
Isolation resistance  
VIO = 500 V, Tamb = 100 °C  
Storage temperature range  
Ambient temperature range  
Tstg  
Tamb  
- 55 to + 150  
- 55 to + 100  
°C  
°C  
max. 10 s dip soldering  
0.5 mm from case bottom  
Soldering temperature (2)  
Tsld  
260  
°C  
Notes  
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not  
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute  
maximum ratings for extended periods of the time can adversely affect reliability.  
Index per DIN IEC60112/VDE 0303 part 1, group IIIa per DIN VDE 6110.  
Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering condditions for through  
hole devices (DIP).  
(1)  
(2)  
www.vishay.com  
2
For technical questions, contact: optocoupleranswers@vishay.com  
This document is subject to change without notice.  
Document Number: 83629  
Rev. 2.0, 29-Mar-11  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
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